IBG Immobilien und Beteiligungs GmbH

BONDSCALE

Recorded computer software for use in processing equipment for processing of electronic circuitry or semi-conductors, in particular of transistors or wafers;Machines and apparatus for producing, aligning, adjusting, bonding, coating, laminating, developing, cleaning, printing, irradiating, thermal treatment and lithographic treatment, namely, nanostructure-imprinting machines, hot embossing machines, micro-contact printing machines, and packaging machines for electronic circuitry or semi- conductors; Structural machine parts and equipment for the aforesaid machines and apparatus, namely, fittings in the nature of couplings for machines, bearings, chucks, joints, and lubricating apparatus for the aforesaid machines and apparatus;BOND SCALE;Technical consultancy, for others, in relation to methods and devices in the field of semiconductor technology, namely, research and design in the area of semiconductor systems, semiconductor cell libraries, wafers and integrated circuits, semiconductor packages, semiconductor testing devices, semiconductor handling and storage devices and semiconductor processing technology; Research and development consulting services in relation to methods and devices in the field of semiconductor technology; Technical system engineering consultation services for others, in relation to methods and devices in the field of semiconductor technology;

EZ BOND

Machines and apparatus for the production, alignment, adjustment, linking, coating, development, cleaning, printing and lithographic treatment, namely, nanostructure imprinting, hot stamping, micro-contact printing, testing and manufacturing of electronic circuits or semiconductors, transistors or wafers; structural parts and equipment for the aforesaid machines and apparatus, included in this class; semiconductor wafer processing machines for processing semiconductors under vacuum; conveyors for conveying semiconductors; machines for the surface treatment of semiconductors; machines for etching semiconductor surfaces, machines for vaporising semiconductor surfaces in particular under vacuum (CVD processes); installations for conveying and providing and processing semiconductors, namely, conveyors and semiconductor wafer processing machines; installations for conveying and processing and providing flat screens, namely, machines for manufacturing LCD- or LED-screens; machines and turnkey production installations for manufacturing semiconductor components from the semiconductor backend sector including light diodes, namely, machines for manufacturing semiconductors; machines for semiconductor manufacturing, machines for chip manufacturing and chip assembly;EASY BOND;BOND;Contract research and contract development, for others, in particular in the fields of micro-systems engineering, micro-mechanics, sensor technology, dosing technology, automation engineering, function and reliability testing, wafer technology, medical technology, time measuring technology and software; scientific research and custom design for others in the field of semiconductors, semiconductor systems, semiconductor cell libraries, wafers and integrated circuits, semiconductor packages, semiconductor testing devices, semiconductor handling and storage devices;

EZ DEBOND

Machines and apparatus for the production, alignment, adjustment, linking, coating, development, cleaning, printing and lithographic treatment, namely, nanostructure imprinting, hot stamping, micro-contact printing, testing and manufacturing of electronic circuits or semiconductors, transistors or wafers; structural parts and equipment for the aforesaid machines and apparatus, included in this class; semiconductor wafer processing machines for processing semiconductors under vacuum; conveyors for conveying semiconductors; machines for the surface treatment of semiconductors; machines for etching semiconductor surfaces, machines for vaporising semiconductor surfaces in particular under vacuum (CVD processes); installations for conveying and providing and processing semiconductors, namely, conveyors and semiconductor wafer processing machines; installations for conveying and processing and providing flat screens, namely, machines for manufacturing LCD- or LED-screens; machines and turnkey production installations for manufacturing semiconductor components from the semiconductor backend sector including light diodes, namely, machines for manufacturing semiconductors; machines for semiconductor manufacturing, machines for chip manufacturing and chip assembly;EASY DE BOND;DEBOND;Contract research and contract development, for others, in particular in the fields of micro-systems engineering, micro-mechanics, sensor technology, dosing technology, automation engineering, function and reliability testing, wafer technology, medical technology, time measuring technology and software; scientific research and custom design for others in the field of semiconductors, semiconductor systems, semiconductor cell libraries, wafers and integrated circuits, semiconductor packages, semiconductor testing devices, semiconductor handling and storage devices;

EZ RELEASE

Machines and apparatus for the production, alignment, adjustment, linking, coating, development, cleaning, printing and lithographic treatment, namely, nanostructure imprinting, hot stamping, micro-contact printing, testing and manufacturing of electronic circuits or semiconductors, transistors or wafers; structural parts and equipment for the aforesaid machines and apparatus, included in this class; semiconductor wafer processing machines for processing semiconductors under vacuum; conveyors for conveying semiconductors; machines for the surface treatment of semiconductors; machines for etching semiconductor surfaces, machines for vaporising semiconductor surfaces in particular under vacuum (CVD processes); installations for conveying and providing and processing semiconductors, namely, conveyors and semiconductor wafer processing machines; installations for conveying and processing and providing flat screens, namely, machines for manufacturing LCD- or LED-screens; machines and turnkey production installations for manufacturing semiconductor components from the semiconductor backend sector including light diodes, namely, machines for manufacturing semiconductors; machines for semiconductor manufacturing, machines for chip manufacturing and chip assembly;EASY RELEASE;RELEASE;Contract research and contract development, for others, in particular in the fields of micro-systems engineering, micro-mechanics, sensor technology, dosing technology, automation engineering, function and reliability testing, wafer technology, medical technology, time measuring technology and software; scientific research and custom design for others in the field of semiconductors, semiconductor systems, semiconductor cell libraries, wafers and integrated circuits, semiconductor packages, semiconductor testing devices, semiconductor handling and storage devices;

EZB

Machines and apparatus for the production, alignment, adjustment, linking, coating, development, cleaning, printing and lithographic treatment, namely, nanostructure imprinting, hot stamping, micro-contact printing, testing and manufacturing of electronic circuits or semiconductors, transistors or wafers; structural parts and equipment for the aforesaid machines and apparatus, included in this class; semiconductor wafer processing machines for processing semiconductors under vacuum; conveyors for conveying semiconductors; machines for the surface treatment of semiconductors; machines for etching semiconductor surfaces, machines for vaporising semiconductor surfaces in particular under vacuum (CVD processes); installations for conveying and providing and processing semiconductors, namely, conveyors and semiconductor wafer processing machines; installations for conveying and processing and providing flat screens, namely, machines for manufacturing LCD- or LED-screens; machines and turnkey production installations for manufacturing semiconductor components from the semiconductor backend sector including light diodes, namely, machines for manufacturing semiconductors; machines for semiconductor manufacturing, machines for chip manufacturing and chip assembly;EASY B;Contract research and contract development, for others, in particular in the fields of micro-systems engineering, micro-mechanics, sensor technology, dosing technology, automation engineering, function and reliability testing, wafer technology, medical technology, time measuring technology and software; scientific research and custom design for others in the field of semiconductors, semiconductor systems, semiconductor cell libraries, wafers and integrated circuits, semiconductor packages, semiconductor testing devices, semiconductor handling and storage devices;

EZD

Machines and apparatus for the production, alignment, adjustment, linking, coating, development, cleaning, printing and lithographic treatment, namely, nanostructure imprinting, hot stamping, micro-contact printing, testing and manufacturing of electronic circuits or semiconductors, transistors or wafers; structural parts and equipment for the aforesaid machines and apparatus, included in this class; semiconductor wafer processing machines for processing semiconductors under vacuum; conveyors for conveying semiconductors; machines for the surface treatment of semiconductors; machines for etching semiconductor surfaces, machines for vaporising semiconductor surfaces in particular under vacuum (CVD processes); installations for conveying and providing and processing semiconductors, namely, conveyors and semiconductor wafer processing machines; installations for conveying and processing and providing flat screens, namely, machines for manufacturing LCD- or LED-screens; machines and turnkey production installations for manufacturing semiconductor components from the semiconductor backend sector including light diodes, namely, machines for manufacturing semiconductors; machines for semiconductor manufacturing, machines for chip manufacturing and chip assembly;[Contract research and contract development, for others, in particular in the fields of micro-systems engineering, micro-mechanics, sensor technology, dosing technology, automation engineering, function and reliability testing, wafer technology, medical technology, time measuring technology and software; scientific research and custom design for others in the field of semiconductors, semiconductor systems, semiconductor cell libraries, wafers and integrated circuits, semiconductor packages, semiconductor testing devices, semiconductor handling and storage devices];

EZR

The following the aforesaid goods included in class 7 being exclusively in the field of semiconductor technology should be inserted at the end of class 7. The aforesaid services included in class 42 being exclusively in the field of semiconductor technology should be inserted at end of the class 42.;Machines and apparatus for the production, alignment, adjustment, linking, coating, development, cleaning, printing and lithographic treatment, namely, nanostructure imprinting, hot stamping, micro-contact printing, testing and manufacturing of electronic circuits or semiconductors, transistors or wafers; structural parts and equipment for the aforesaid machines and apparatus, included in this class; semiconductor wafer processing machines for processing semiconductors under vacuum; conveyors for conveying semiconductors; machines for the surface treatment of semiconductors; machines for etching semiconductor surfaces, machines for vaporising semiconductor surfaces in particular under vacuum (CVD processes); installations for conveying and providing and processing semiconductors, namely, conveyors and semiconductor wafer processing machines; installations for conveying and processing and providing flat screens, namely, machines for manufacturing LCD- or LED-screens; machines and turnkey production installations for manufacturing semiconductor components from the semiconductor backend sector including light diodes, namely, machines for manufacturing semiconductors; machines for semiconductor manufacturing, machines for chip manufacturing and chip assembly; * the aforesaid goods included in class 7 being exclusively in the field of semiconductor technology *;[Contract research and contract development, for others, in particular in the fields of micro-systems engineering, micro-mechanics, sensor technology, dosing technology, automation engineering, function and reliability testing, wafer technology, medical technology, time measuring technology and software; scientific research and custom design for others in the field of semiconductors, semiconductor systems, semiconductor cell libraries, wafers and integrated circuits, semiconductor packages, semiconductor testing devices, semiconductor handling and storage devices; * the aforesaid services included in class 42 being exclusively in the field of semiconductor technology *];

HICC

Scientific apparatus and instruments for microelectronics, for medical equipment techniques, biotechnology, microsystem techniques, semiconductor and nanotechnology; surveying devices, electric, photographic, optical, measuring, signalling, and monitoring devices, in particular for precision systems in the semiconductor technology, in microelectronics, in medical equipment techniques, biotechnology, microsystem techniques, and nanotechnology; apparatus for chemical analysis; chips, integrated circuits; computer operation programs; peripheral equipment for computer; data processing units, data processing devices and computer; computer software; diagnosis devices in bio-chip format, namely, oligonucleotide-arrays, miniaturized immunologic test-arrays, substance libraries, combinatorial substance libraries on chip surfaces for scientific purposes; electric systems for remote controlled industrial operational processes; computer systems for manufacturing plants for microelectronics, medical equipment techniques, biotechnology, microsystem techniques, and nanotechnology; protective masks and filters therefor for use with photographic and photolithographic equipment and photographic film processing; devices for telecommunications; telegraphic transmitting apparatus; telecopying devices; telephones; semiconductors; capillary tubes; monitoring devices (electric); couplers (data processing equipment); special furniture for laboratories; laser (for non-medical purposes); reading devices (data processing); measuring instruments; measuring devices; material testing instruments and machines; diaphragms for scientific apparatus; optical apparatus and instruments; photographic apparatus and instruments; physical and chemical laboratory apparatus and instruments; precision measuring devices; projectors; protective clothing, in particular for clean-rooms; silicon wafers; probes for scientific purposes; spectroscopes; finders for photographic equipment;Machines and machine tools for microelectronics, medical equipment techniques, biotechnology, microsystem techniques, semiconductor technology, nanotechnology, wafer bonding, lithography equipment; machines for manufacturing electronic components and optical and technical devices; precision machines as well as spare parts for the same; self-regulating pumps;Scientific and technological services and research and design relating thereto; industrial analysis, industrial research and industrial design services; quality control and authentication services; design and development of computer hardware and software; scientific laboratory services; engineering; computer programming; engineering and scientific services; evaluations, estimates, research and reports in the scientific and technological fields; technological consultancy; software as a service (SaaS); platform as a service (PaaS); conducting technical project studies; material testing; calibration; construction drafting; research and development of new products for others; research in the field of physics; mechanical research; engineering services; development of precision systems and devices for the semiconductor technology; development of devices for microsystem techniques, microelectronics, medical techniques, biotechnology, telecommunication, wafer bonding, lithography equipment; providing systems technology solutions for sensorics and diagnostics, in particular of biology and medicine; research work in the field of bio-technology; research work in the field of microsystem technology, nanotechnology, wafer bonding, lithography equipment; research work in the field of bio-sensorics and chemical sensorics; technological consulting for third parties concerning handling production plants and process equipment; microsystem technology and nanotechnology services; providing temporary use of non-downloadable computer programs for data processing;

INVENT INNOVATE IMPLEMENT

The mark consists of three letter I's depicted by black rectangles. In the body of the first letter I, the word INVENT appears in white. In the body of the second letter I, the word INNOVATE appears in white. In the body of the third letter I, the word IMPLEMENT appears in white.;Computer software for use in processing equipment for processing of electronic circuitry or semi-conductors, in particular of transistors or wafers; machines and apparatus for testing, namely, testing machines for semiconductors, tensile testing machines, optical inspection apparatus for inspection of semiconductor materials; Electronic apparatus for testing semiconductor wafer conductivity and circuitry testing; ultrasonic inspection devices for non-medical and non-destructive testing, metal strength testing machines, semi-conductor wafer probes and wafer test metrology equipment for nanostructure-imprinting, hot-embossing, micro-contact printing, wafer testing, and package testing machines for electronic circuitry or semi-conductors; parts and equipment for the aforesaid machines and apparatus, included in this class, namely, batteries, electric wires and cables;Machines and apparatus for producing, aligning, adjusting, bonding, coating, laminating, developing, cleaning, printing, irradiating, thermal treatment and lithographic treatment, namely, nanostructure-imprinting machines, hot embossing machines, micro-contact printing machines, and packaging machines for electronic circuitry or semi-conductors; parts and equipment, namely, fittings, bearings, chucks, joints and lubricating apparatus for the aforesaid machines and apparatus, included in this class;The color(s) black and white is/are claimed as a feature of the mark.;Technical consultancy, for others, in relation to methods and devices in the field of semiconductor technology, namely, research and design in the area of semiconductor systems, semiconductor cell libraries, wafers and integrated circuits, semiconductor packages, semiconductor testing devices, semiconductor handling and storage devices and semiconductor processing technology; contractual research and contractual development, for others, in relation to methods and devices in the field of semiconductor technology; technical system engineering, for others, in relation to methods and devices in the field of semiconductor technology;