BONDSCALE

Welcome to the Brand page for “BONDSCALE”, which is offered here for Recorded computer software for use in processing equipment for processing of electronic circuitry or semi-conductors, in particular of transistors or wafers;machines and apparatus for producing, aligning, adjusting, bonding, coating, laminating, developing, cleaning, printing, irradiating, thermal treatment and lithographic treatment, nanostructure-imprinting machines, hot embossing machines, micro-contact printing machines, and packaging machines for electronic circuitry or semi- conductors; structural machine parts and equipment for the aforesaid machines and apparatus, fittings in the nature of couplings for machines, bearings, chucks, joints, and lubricating apparatus for the aforesaid machines and apparatus;bond scale;technical consultancy, for others, in relation to methods and devices in the field of semiconductor technology, research and design in the area of semiconductor systems, semiconductor cell libraries, wafers and integrated circuits, semiconductor packages, semiconductor testing devices, semiconductor handling and storage devices and semiconductor processing technology; research and development consulting services in relation to methods and devices in the field of semiconductor technology; technical system engineering consultation services for others, in relation to methods and devices in the field of semiconductor technology;.

Its status is currently believed to be active. Its class is unavailable. “BONDSCALE” is believed to be currently owned by “IBG Immobilien und Beteiligungs GmbH”.