PROCESS EQUIPMENT COUPLING

Brand Owner Address Description
CMPLICITY ADVANCED TECHNOLOGY MATERIALS, INC. 7 Commerce Drive Danbury CT 06810 Process equipment for coupling to semiconductor manufacturing machines and semiconductor wafer processing equipment, namely, dispensers for delivering metered or measured amounts of chemical mechanical polishing and planarization compositions and post-chemical mechanical polishing and planarization cleaning compositions to machines performing chemical mechanical polishing and planarization processes and machines performing post-chemical mechanical polishing and planarization processes in the manufacture of semiconductor and microelectronic products;Process equipment for coupling to semiconductor manufacturing machines and semiconductor wafer processing equipment, namely, mixing machines for blending, mixing and delivering chemicals and chemical mechanical polishing and planarization compositions to machines performing chemical mechanical polishing and planarization processes in the manufacture of semiconductor and microelectronic products; and mixing machines for blending, mixing, and delivering chemicals and post-chemical mechanical polishing and planarization cleaning compositions to machines performing post-chemical mechanical polishing and planarization processes in the manufacture of semiconductor and microelectronic products;Process equipment for coupling to semiconductor manufacturing machines and semiconductor wafer processing equipment, namely, metal fluid storage tanks for holding chemical mechanical polishing and planarization compositions, and for holding post-chemical mechanical polishing and planarization cleaning compositions, for machines performing chemical mechanical polishing and planarization processes and for machines performing post-chemical mechanical polishing and planarization processes in the manufacture of semiconductor and microelectronic products;Chemical mechanical polishing and planarization preparations for use in chemical mechanical polishing and planarization processes in the manufacture of semiconductor and microelectronic products;SIMPLICITY;Chemicals for use in chemical mechanical polishing and planarization processes in the manufacture of semiconductor and microelectronic products;Process equipment for coupling to semiconductor manufacturing machines and semiconductor wafer processing equipment, namely, plastic fluid storage tanks for holding chemical mechanical polishing and planarization compositions, and for holding post-chemical mechanical polishing and planarization cleaning compositions, for machines performing chemical mechanical polishing and planarization processes and for machines performing post-chemical mechanical polishing and planarization processes in the manufacture of semiconductor and microelectronic products;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. The non-destructive inspection equipment is provided with voice interaction to interface with the inspector and/or operator who preferably controls the inspection equipment and the inspection process, at least in part, through the use of voice control and by receiving audio and/or video feedback from the inspection equipment. The overall inspection quality is preferably substantially improved when the inspector and/or operator can focus entirely on the material under inspection while maintaining full control of the inspection equipment and the inspection process. The inspection equipment and its interfaces are adapted and fine-tuned for interaction with humans, particularly in a harsh noise industrial environment. Further, the voice interaction preferably allows the inspector and/or operator to operate the inspection equipment while wearing gloves or with dirty hands as he/she will not need to constantly physically manipulate the inspection equipment.