TRANSENE COMPANY, INCORPORATED

ACID-AID

SUSPENSION OF MAGNESIUM OXIDE IN GLYCERIN, USED AS A FIRST AID TREATMENT FOR HYDROFLUORIC ACID BURNS;

EPOTHERM

EPOXY RESIN AND ALUMINUM OXIDE FOR USE AS A POTTING AND ENCAPSULATING AGENT;

ESP

SOLUTION OF COPPER FLUORIDE, USED FOR POLISHING;

FARADEX

DIELECTRIC FOR MAKING CAPACITORS;

HYBRISIL

PROTECTIVE SILICONE COATING FOR ELECTRONIC CIRCUITS;

INSUL-BOND

Epoxy Adhesives (One-Part & Two Part Curing Systems) Used for Component Attachment, Substrate Mounting & Lid Sealing in Microelectronics;

MBS

SILICONE MATERIAL USED AS A PROTECTIVE COATING AND MOISTURE BARRIER FOR SEMICONDUCTORS, ELECTRONIC COMPONENTS AND ELECTRONIC CIRCUIT MODULES;

MICRO-SIL

MICROWAVE ENERGY ABSORBER, USED TO ABSORB LEAKING MICROWAVE ENERGY IN RADIO-FREQUENCY CIRCUITS, AND AS AN ATTENUATOR MATERIAL IN MICROWAVE CIRCUIT APPLICATIONS;

MICROPOXY

TWO-COMPONENT MICROWAVE ENERGY ABSORBER;

NEUTRAFLUX

LIQUID ORGANIC COMPOSITION USED AS A FLUX FOR SOLDERING;

NICKEL-MET

AIR-DRYING CONDUCTIVE COMPOSITION CONTAINING NICKEL FOR METALLIZING NONCONDUCTORS, USED IN CONNECTION WITH PRINTED CIRCUIT BOARDS, ELECTRICAL CONTACTS AND THE LIKE;

PKP

PURIFIED PHOTORESIST COMPOSITION USED IN PHOTO LITHOGRAPHY;

POLY-CLEAR

LIQUID CHEMICAL POLYMER FOR MOUNTING AND IMBEDDING METALLURGIC, BIOLOGICAL, MECHANICAL SPECIMENS;

Q-LAC

Q LAC;POLYSTYRENE RESIN SOLUTION IN A SUITABLE SOLVENT TYPE VEHICLE, FOR PROTECTIVELY COATING AND INSULATING ELECTRONIC COMPONENTS AND CIRCUITS;

RESIST-AID

PHOTORESIST ADHESION PROMOTER USED ON SILICON AND OTHER SEMICONDUCTOR SUBSTRATE MATERIALS TO IMPROVE THE ADHESION OF PHOTORESIST FILMS IN THE TECHNOLOGY FOR THE MANUFACTURE OF TRANSISTORS, INTEGRATED CIRCUITS AND OTHER SEMICONDUCTOR DEVICES, PURCHASED BY ELECTRONICS COMPANIES WHICH MANUFACTURE TRANSISTORS, INTEGRATED CIRCUITS AND RELATED DEVICES;

RTM

CHEMICAL LIQUID SOLUTION USED IN THE ROOM TEMPERATURE NICKEL METALLIZING PROCESS FOR ALUMINA CERAMICS AND OTHER POLYMERIC MATERIALS;

SEQUESTROX

ETCHING ADJUNCT FOR SILICON DEVICES;

SILICOAT

DIELECTRIC COATING USED TO PROTECT PRINTED CIRCUIT BOARDS AGAINST MOISTURE;

SILOXIDE ETCHANT

CHEMICAL ETCHANT FOR SILICA FOR USE IN SEMICONDUCTOR PROCESSING;THE WORD ETCHANT IS DISCLAIMED APART FROM THE MARK.;

SILVER-MET

AIR DRYING CONDUCTIVE SILVER COMPOSITION FOR METALLIZING NON-CONDUCTORS;

TECH-WAX

GENERAL PURPOSE WAX USED FOR MOUNTING SEMI-CONDUCTOR MATERIALS, AND OTHER MATERIALS, SUCH AS GLASS AND CERAMICS, SUCH WAX MOUNTING BEING NECESSARY TO HOLD THE MATERIAL STEADY WHILE IT IS SUBJECTED TO VARIOUS MANUFACTURING OPERATIONS, SUCH AS CUTTING, SLICING, DICING OR ETCHING;

TIMETCH

CONTROLLED ETCHANT FOR SILICON DIOXIDE FILMS FOR USE GENERALLY IN MICROCIRCUITS;

TRANSCAST

SILICONE MOULD MAKING MATERIAL FOR CASTINGS;

TRANSEAL

SILICONE ADHESIVE COMPOUND APPLIED AS AN ADHESIVE OR SEALANT IN ELECTRONIC APPLICATIONS;

TRANSENE

THERMOSETTING SILVER FOR CONDUCTIVE BONDING IN MICROELECTRONIC CIRCUITS USED IN THE ELECTRONICS INDUSTRY;

TRANSENE

CHEMICAL SPECIALITIES FOR THE SOLID STATE AND ELECTRONICS INDUSTRIES;

TRANSENE-100

CLEANING PREPARATION FOR USE IN THE PROCESSING OF SEMICONDUCTOR DEVICES, SUCH AS TRANSISTORS, DIODES, RECTIFIERS, AND CONTROLLED RECTIFIERS;

TRANSEPOXY

EPOXY RESIN FORMULATION USED FOR POTTING AND ENCAPSULATION OF ELECTRONIC PARTS AND OTHER APPLICATIONS;

TRANSETCH

LIQUID SELECTIVE ETCHANT FOR ETCHING SILICON NITRIDE;

TRANSLASTIC

SILICONE ELASTOMER SYSTEMS OR COMPOSITIONS;TRANSELASTIC;

TUD

DETERGENT SOLUTION USED FOR ULTRASONIC CLEANING OF ELECTRONIC PARTS AND SEMICONDUCTOR MATERIALS;

XTHERM

ALUMINUM OXIDE IN A SILICONE BASE USED PRINCIPALLY IN ELECTRONIC APPLICATIONS AS A DIELECTRIC, AND ALSO USED IN OTHER APPLICATIONS TO FACILITATE THE DISSIPATION OF HEAT;