TECHNIC, INC.

TECHNICAL SERVICE RENDERED TO CUSTOMERS INVOLVING ADVICE ON CONTROL AND USE OF PROCESSES FOR ELECTRO PLATING PRECIOUS METALS;

ACR

[ METAL RECLAMATION SERVICES ];SOLUTIONS FOR PLATING METAL AND CHEMICALS USED THEREFOR, NAMELY, METAL SALTS, BRIGHTENERS, ELECTROLYTES, ACTIVATORS AND WETTING AGENTS, ETCHANTS, AND METAL STRIPPING COMPOSITIONS;

ARGENTOMERSE

IMMERSION PLATING SOLUTION FOR COVERING BASE METAL OBJECTS WITH SILVER;

CONVERGENCE

Chemical solutions, powders, salts and alloys for use in plating, immersing, and coating of precious metals and non-precious metals; etchants for use in electronics manufacturing;

COTE D'OR

GOLD PLATING SOLUTIONS;THE MARK IS TRANSLATABLE IN ENGLISH AS GOLD COAST.;

CYLESS

THE DRAWING IS AMENDED TO APPEAR AS FOLLOWS: CYLESS;CYLESS;CYANIDE-FREE METALLIC SALTS FOR USE AS AN ELECTROPLATING COMPOSITION;

FAST FINGER PLATER

Electro-Plating Apparatus;

INDUSTRIAL

GOLD PLATING SOLUTION AND SALTS TO BE USED IN GOLD PLATING SOLUTIONS;THE WORD INDUSTRIAL IS DISCLAIMED APART FROM THE MARK SHOWN.;

JETAL

SALTS FOR THE TREATMENT OF FERROUS METAL SURFACES, IN CONNECTION WITH OXIDIZING WITH OR WITHOUT ELECTRICAL CURRENT;

L'EAU ULTIME

personal care products, namely, skin creams, skin lotions, skin moisturizers, shower gels, skin exfoliant and make-up remover;

NICKELMERSE

IMMERSION PLATING SOLUTION FOR COVERING BASE METAL OBJECTS WITH NICKEL;

ORITE

GOLD PLATING SOLUTION;

OROCLAD

GOLD PLATING SOLUTIONS AND COMPOSITIONS;

OROFLO

GOLD PLATING SOLUTIONS AND COMPOSITIONS;OROFLOW;

OROMERSE

Gold Plating Solution and Salts to Be Used in Gold Plating Solutions;

OROSENE

GOLD PLATING SOLUTION AND SALTS TO BE USED IN GOLD PLATING SOLUTIONS;

OROTEMP

Gold Plating Solution and Salts to Be Used in Gold Plating Solutions;

OROTHERM

Gold Plating Solution and Salts to Be Used in Gold Plating Solutions;

PALLABAR

PALLADIUM SOLUTION FOR THE DEPOSITION OF PALLADIUM;

PALLAMERSE

PALLADIUM SOLUTION FOR THE DEPOSITION OF PALLADIUM;

S-LESS

RHODIUM PLATING SOLUTION FOR THE DEPOSITION OF RHODIUM;S LESS;

S-LESS

RHODIUM PLATING SOLUTION FOR THE DEPOSITION OF RHODIUM;

SEMCON

Semiconductor wafer plating processing machines;

SPX

GOLD PLATING SOLUTION;

STANOMERSE

IMMERSION PLATING SOLUTION FOR COVERING BASE METAL OBJECTS WITH TIN;

TARNIBAN

CHEMICAL COMPOSITION FOR A TARNISH PREVENTATIVE FOR SILVER, SILVER ELECTROPLATE, COPPER, COPPER ALLOYS, BRASS, AND GOLD PLATED SILVER AND GOLD PLATED COPPER;

TARNIBAN

CHEMICAL COMPOSITION FOR A TARNISH PREVENTATIVE SILVER, SILVER ELECTROPLATE, COPPER, COPPER ALLOYS, BRASS AND GOLD PLATED SILVER AND GOLD PLATED COPPER;

TEC NICK

PLATING SOLUTIONS FOR PRECIOUS METALS;

TECHNI GOLD

THE MARK IS AMENDED TO APPEAR AS FOLLOWS: TECHNI GOLD, and, In the statement, Column 2, after line 4 NO CLAIM IS MADE TO THE EXCLUSIVE RIGHT TO USE GOLD APART FROM THE MARK AS SHOWN should be inserted.;TECHNICAL GOLD;CHEMICAL GOLD ELECTROPLATING SOLUTIONS WHICH CONSIST IN PART OF PURE GOLD AND ALLOYS OF GOLD;GOLD;

TECHNI RHODIUM

In the statement, column 2, after line 2, The mark consists of standard characters, without claim to any particular font style, size or color is inserted. The drawing is amended to appear as follows: TECHNI RHODIUM;TECHNICAL RHODIUM;RHODIUM PLATING SOLUTIONS;

TECHNI SILVER

In the statement, column 2, after line 2, The mark consists of standard characters, without claim to any particular font style, size or color. is inserted. The drawing is amended to appear as follows: TECHNI SLIVER;TECHNICAL SILVER;SILVER PLATING SOLUTIONS;

TECHNI WHITE

In the statement, The mark consists of standard characters, without claim to any particular font style, size or color. is inserted. In the Statement, WHITE is inserted. The drawing is amended to appear as follows: TECHNI WHITE;PLATING SOLUTIONS FOR RHODIUM;WHITE;

TECHNI-BLACK

PLATING SOLUTION USEFUL FOR DEPOSITING BLACK COATINGS ON BASE METAL;

TECHNI-GOLDCLAD

GOLD ELECTRO-PLATED JEWELRY;

TECHNI-NICKEL

PLATING SOLUTIONS FOR NICKEL;

TECHNIC, INC

PRECIOUS METAL PLATING SOLUTION AND CHEMICALS FOR MAINTAINING PRECIOUS METAL PLATING BATH;TECHNIQUE INC;

TECHNIC-LAB

APPARATUS FOR ELECTROPLATING PRECIOUS METALS COMPRISING A RECTIFIER, THERMOSTATS, HEATERS, PLATING APPARATUS AND TANKS FOR HOLDING SOLUTIONS CAPABLE OF DEPOSITING METAL;

TECHNIGOLD

GOLD AND GOLD PLATING SOLUTIONS;

TECHNIMERSE

IMMERSION PLATING SOLUTIONS FOR ANY AND ALL METALS PLATABLE BY IMMERSION;

TECHNIPLATINUM

PLATINUM AND PLATINUM PLATING SOLUTIONS;

TECHNIPLATINUM

TECHNICAL PLATINUM;PURE PLATINUM AND ALLOYS OF PLATINUM FOR USE IN PLATINUM PLATING SOLUTIONS; AND PLATINUM PLATING SOLUTIONS;

TECHNIRHODIUM

RHODIUM PLATING SOLUTIONS;

TECHNISILVER

SILVER PLATING SOLUTIONS;

TECHNISOL

Chemicals for use in the manufacture of photovoltaic and solar cells, modules, and devices;

TRUSHADE

GOLD PLATING SOLUTION;TRUESHADE;