OMI INTERNATIONAL CORPORATION

76 BRN

Chemicals for Use in Nickel Electroplating Processes;

ALAUTRONEX

ELECTROLYTES FOR GOLD AND GOLD ALLOY PROCESSES;

AURION-X

AURION X;ION-EXCHANGE APPARATUS FOR THE RECOVERY OF GOLD FROM SOLUTIONS THEREOF;

BDT

GOLD PLATING COMPOSITION;

CIRCUITPREP

Chemicals for Use in the Treatment of Substrates Prior to Electroplating;

CROMYLITE

CHEMICALS FOR USE IN THE ELECTRODEPOSITION OF METALS;CHROMELITE;

CUBATH

ANODES FOR USE IN ELECTROLYTIC PROCESSES AND APPARATUSES;

EXYLITE

Chemicals for Use in Nickel Electroplating Processes;

HI-STEP

Chemicals for Use in Electroplating Processes, Particularly, Semi-Bright Nickel Electroplating Processes;

INDEX

Chemicals for Use in Electroplating Processes, Particularly for Use in the Electrodeposition of Indium;

INTERPLATE

Chemicals for Use in Electroplating Processes, Particularly, Copper Electroplating Processes;

MAGNUM

Chemicals for Use in Nickel Electroplating Processes;

MODULE-X

X;Tank Units of Electroplating Equipment;

OMI

CLEANING PREPARATIONS FOR USE IN THE METAL FINISHING INDUSTRY;

OMI

CONSULTING SERVICES TO OTHERS IN THE DESIGN AND OPERATION OF COMPLETE ELECTROPLATING INSTALLATIONS AND WASTE TREATMENT SYSTEMS, FOR USE IN THE METAL FINISHING INDUSTRY;

OMI

PERIODICAL PUBLICATIONS AND PRINTED MATTER, NAMELY, NEWSLETTERS, BROCHURES, LEAFLETS, TECHNICAL BULLETINS AND OPERATING MANUALS, FOR USE IN THE SURFACE FINISHING INDUSTRY;

OMI

AUTOMATED EQUIPMENT FOR ELECTROPLATING INSTALLATIONS AND WASTE TREATMENT INSTALLATIONS, AND PARTS THEREOF, NAMELY, RECTIFIERS, AND COMPUTERIZED PROGRAMMING CONTROLS, ANODES, ELECTROPLATING TANKS AND BARRELS FOR HOLDING WORKPIECES ALL SOLD AS A UNIT;

ORASORB

FILTRATION AND PURIFICATION CARTRIDGES;

P. T. S.

Chemicals for Use in Electroplating Processes, in Particular, Gold Electroplating Processes;

PERMANODE

ELECTRODES FOR USE IN ELECTROLYTIC BATHS;

SPECTRALYTE

SPECTRALIGHT;Chemicals for Use in Electroplating Baths;

TRI-NI

CHEMICAL PLATING SOLUTION AND ADDITION AGENTS FOR USE IN THE ELECTRODEPOSITION OF METALS;

UDYSTRIP

CHEMICALS FOR USE IN COMPOSITIONS FOR REMOVING PROTECTIVE, DECORATIVE AND/OR FUNCTIONAL COATINGS FROM SUBSTRATES;

WILBRO

Chemicals for Use in Electroplating or Electrodeposition of Precious Metals - Particularly, Gold Electroplating Processes, Processes for Electroplating or Electrodeposition of Precious Metals;

Z-BRITE

CHEMICALS FOR USE IN THE ELECTRODEPOSITION OF METALS;Z BRIGHT;