IBG Immobilien und Beteiligungs; GmbH

LOWTEMP DEBOND

Computer software for use in processing equipment for processing of electronic circuitry or semi-conductors, in particular of transistors or wafers;Machines and apparatus for producing, aligning, adjusting, bonding, coating, laminating, developing, cleaning, printing, irradiating, thermal treatment and lithographic treatment, namely, nanostructure-imprinting machines, hot embossing machines, micro-contact printing machines, and packaging machines for electronic circuitry or semi-conductors; parts and equipment, namely, fittings, bearings, chucks, joints and lubricating apparatus for the aforesaid machines and apparatus, included in this class;LOW TEMP DEBOND;Technical consultancy, for others, in relation to methods and devices in the field of semiconductor technology, namely, research and design in the area of semiconductor systems, semiconductor cell libraries, wafers and integrated circuits, semiconductor packages, semiconductor testing devices, semiconductor handling and storage devices and semiconductor processing technology; research and development, for others, in relation to methods and devices in the field of semiconductor technology; technical system engineering, for others, in relation to methods and devices in the field of semiconductor technology;

TRIPLE I - THE KEY TO YOUR SUCCESS

Computer software for use in processing equipment for processing of electronic circuitry or semi-conductors, in particular of transistors or wafers; machines and apparatus for testing, namely, testing machines for semiconductors, tensile testing machines, optical inspection apparatus for inspection of semiconductor materials; Electronic apparatus for testing semiconductor wafer conductivity and circuitry testing; ultrasonic inspection devices for non-medical and non-destructive testing, metal strength testing machines, semi-conductor wafer probes and wafer test metrology equipment for nanostructure-imprinting, hot-embossing, micro-contact printing, wafer testing, and package testing machines for electronic circuitry or semi-conductors; parts and equipment for the aforesaid machines and apparatus, included in this class, namely, batteries, electric wires and cables;Machines and apparatus for producing, aligning, adjusting, bonding, coating, laminating, developing, cleaning, printing, irradiating, thermal treatment and lithographic treatment, namely, nanostructure-imprinting machines, hot embossing machines, micro-contact printing machines, and packaging machines for electronic circuitry or semi-conductors; parts and equipment, namely, fittings, bearings, chucks, joints and lubricating apparatus for the aforesaid machines and apparatus, included in this class;Technical consultancy, for others, in relation to methods and devices in the field of semiconductor technology, namely, research and design in the area of semiconductor systems, semiconductor cell libraries, wafers and integrated circuits, semiconductor packages, semiconductor testing devices, semiconductor handling and storage devices and semiconductor processing technology; contractual research and contractual development, for others, in relation to methods and devices in the field of semiconductor technology; technical system engineering, for others, in relation to methods and devices in the field of semiconductor technology;