MATTSON TECHNOLOGY, INC.

AGILIS

semiconductor processing equipment;

ALPINE

Semiconductor manufacturing equipment, namely, semiconductor wafer processing chambers;

ASPEN

Machinery in the nature of equipment for the treatment and processing of semiconductor substrates and other semiconductor workpieces, semiconductor substrates, silicon wafers and semiconductor wafers;

ATOMIC INTERFACE ENGINEERING

servicing of equipment for the treatment and processing of substrates and other workpieces, semiconductor substrates, silicon wafers and wafers, including equipment for rapid thermal processing, dry strip, and etch applications;

ATOMIC SURFACE ENGINEERING

servicing of equipment for the treatment and processing of substrates and other workpieces, semiconductor substrates, silicon wafers and wafers, including equipment for rapid thermal processing, dry strip, and etch applications;

ESCALA

Semiconductor processing equipment, namely, processing chambers for semiconductor substrates for carrying out various processes including etch processes;

FRTP

Processing equipment for semiconductor wafers;

HAL-CVD

SEMICONDUCTOR WAFER PROCESSING TOOL FOR DEPOSITING A THIN FILM ONTO A WAFER;

HOT SHIELD

Semiconductor wafer processing equipment, namely, light absorbing plates for heating semiconductor wafers in thermal processing chambers;

HYBRID ATOMIC LAYER CVD

Tool for depositing a thin film onto a substrate;CVD;

HYBRID ATOMIC LAYER DEPOSITION

Tool for depositing a thin film onto a substrate;

HYDRILIS

Machinery in the nature of equipment for the treatment and processing of semiconductor substrates and other semiconductor workpieces, semiconductor substrates, silicon wafers and semiconductor wafers;

MATTSON TECHNOLOGY

equipment for the treatment and processing of semiconductor substrates and other semiconductor workpieces, semiconductor substrates, silicon wafers and semiconductor wafers, including equipment for rapid thermal processing, dry strip, and etch applications;servicing of equipment for the treatment and processing of substrates and other workpieces, semiconductor substrates, silicon wafers and wafers, including equipment for rapid thermal processing, dry strip, and etch applications;TECHNOLOGY;

MAXUS

processing equipment for semiconductor wafers including semiconductor platforms and processing modules;

MILLIOS

Semiconductor wafer processors;The wording MILLIOS has no meaning in a foreign language.;

NEXION

Semiconductor processing equipment, namely, processing chambers for semiconductor substrates for carrying out various processes including etch processes;

NOVYKA

semiconductor processing equipment;

NOVYKA AQUA

semiconductor processing equipment;

NOVYKA OLEO

semiconductor processing equipment;

PARADIGME

Semiconductor processing equipment, namely, processing chambers for semiconductor substrates for carrying out various processes including etch processes;

RETT

Equipment for the treatment and processing of semiconductor substrates and other semiconductor workpieces, semiconductor substrates, silicon wafers and semiconductor wafers, including equipment for rapid thermal processing, dry strip, and etch applications;

SCISSORBOT

Machinery in the nature of equipment for the handling of semiconductor substrates and other semiconductor workpieces, namely, semiconductor wafers, silicon wafers and other semiconductor substrates;SCISSOR BOT;

SUPREMAXE

semiconductor manufacturing equipment, namely, processing chambers for stripping photoresist materials;SUPREME AX;

VORTEK

ELECTRIC ULTRA-HIGH INTENSITY LAMPS AND PARTS THEREFOR;