Amerasia International Technology, Inc.

AIT

AMERASIA INTERNATIONAL TECHNOLOGY;adhesives and chemical products made by the company for use in semiconductors and electronic industries;

CHIP-CARRIER

Carriers and containers, namely, trays, waffle-packs, tape-and-reel, and boxes for storing and shipping of semiconductor dies, electronic components and modules;CHIP CARRIER;

CIRCUITSEAL

Liquid conformal coatings, namely. electrically insulating coatings for electronic components, devices and/or assemblies;CIRCUIT SEAL;

COOL-BOND

Thermally conductive chemical adhesive compounds in film format that are pre-applied onto metal heat-spreader lids for bonding between heat generating devices and lids that function also as heat-sinks or heat-spreaders for use in the power conversion, power supply, motor control, computer, and general electronic industries;

COOL-GAP

COOL GAP;Thermal interface material used in cooling by filling in gaps of electronic devices;

COOL-GEL

adhesives for electronic assembly, namely, thermally conductive chemical compounds that cures in situ into gel-like consistency for use in the power conversion, power supply, motor control, computer, and electronic industries;

COOL-GREASE

COOL GREASE;non-curing thermally conductive chemical compounds in paste format for use as interface between heat generating electronic devices and heatsinks in power conversion, power supply, motor control, computer, and electronic industries;

COOL-LID

Thermally conductive chemical adhesive compounds in both paste and film formats that cure in situ or with heat to form strong bonding between heat generating devices and heat-sinks or heat-spreaders for use in the power conversion, power supply, motor control, computer and general electronic industries;

COOL-PAD

COOL PAD;non-curing or curing thermally conductive chemical compounds in paste format for use as interface between heat generating electronic devices and heatsinks in power conversion, power supply, motor control, computer, and electronic industries;

COOL-PATH

COOL PATH;Thermal conductive compounds and solutions placed between heat generating devices and heat-sink or heat-spreader to form bridge of heat conduction;

ELECTROGREASE

LIQUID, GREASE-LIKE POLYMER-BASED ELECTRICALLY CONDUCTIVE MATERIALS FILLED WITH METALLIC, CARBON AND OTHER CONDUCTIVE AND SEMI-CONDUCTIVE FILLER MATERIALS;ELECTRO GREASE;

FLUOROSEAL

Liquid conformal coatings, namely, electrically insulating coatings;Liquid conformal coatings, namely, surface protective coatings for providing moisture and/or chemical protection;

HERMETIC-BOND

HERMETIC-BOND is used as an adhesive for joining and forming enclosure with cavity for low moisture penetration;

HYPER-CONDUCTIVE

CONDUCTIVE POLYMERS, FOR USE IN ELECTRONIC AND MICROELECTRONIC APPLICATIONS;

MAGNETO-CONDUCTIVE

CONDUCTIVE WITH BOTH HIGH ELECTRICAL CONDUCTIVITY AND MAGNETIC PERMEABILITY FOR SHIELDING AGAINST ELECTROMAGNETIC SIGNAL OR NOISE;

OPTO-CLAD

OPTO CLAD;Optically clear adhesives and bonding media for bonding optical components, glass windows, and other optical components when cured;

PRIMA-BOND

Epoxy Adhesives, Polyurethane Adhesives, Silicone Adhesives, and Polyimide Adhesive;

PRIMA-CAST

Casting, Potting, Encapsulating Compounds Made with Epoxies, Polyurethanes, and Silicones;

PRIMA-COAT

POLYMERIC BASED, CONDUCTIVE OR INSULATING COATINGS FOR INDUSTRIAL, COMMERCIAL, MILITARY, AND HOUSEHOLD USES;

PRIMA-SEAL

SEALANTS FOR INDUSTRIAL, COMMERCIAL, MILITARY AND HOUSE-HOLD USES;

PRIMA-SHIELD

ELECTRICALLY CONDUCTIVE AND/OR MAGNETICALLY PERMEABLE ADHESIVES, SEALANTS, COATINGS, GASKETS OR ANY MEANS OR MEDIA FOR SHIELDING AGAINST ELECTROMAGNETIC SIGNAL OR NOISE;

PRIMA-SOLDER

Conductive Epoxy, Polyurethane, Silicone, and Polyimide Adhesives;

PRIMA-STEEL

Polymer-Filled Composites of Epoxy, Polyurethane, Silicone and Polymide for Use in Construction, Machinery, Structural Parts in Industry and in the Home;

SNAP-LID

Protective covers and lids have been pre-applied with fast bonding or curing adhesive preforms, for use in place of encapsulant and molding compound used for protection of semiconductor, electronic modules;

SOLDER-SUB

SOLDER SUB;electrically conductive adhesive that can be screened or stenciled onto substrate and cured as adhesive;

ZIF-FILM

electrical connection comprised of polymer film with selective electrically conductive columns distributed within an electrically insulating substrate for use in forming interconnection between two electronic substrates in semiconductor, component, circuit jumper, and other fine pitch interconnection applications in the power conversion, power supply, motor control, computer, and general electronic industries;