XSEMI

Welcome to the Brand page for “XSEMI”, which is offered here for Cmos image sensor packaging in the nature of integrated circuit assembly; semiconductor packaging in the nature of integrated circuit assembly; manufacturing processing of semiconductors, wafers, and integrated circuits for others; assembly of semiconductors, wafers, and integrated circuits for others; packaging of semiconductors, wafers, and integrated circuits for others in the nature of integrated circuit assembly; metal laminating; laminating of plastic, metal, ceramic or glass sheets; laminating of plastic sheets; molding of plastic materials;integrated circuit modules; electronic integrated circuits; circuit boards provided with integrated circuits; semiconductor chips; computer chips; integrated circuit modules for use with infrared detectors; chip carriers, semiconductor chip housings; integrated circuits; photoelectric sensors; infrared sensors; optical lenses; optical mirrors; printed circuit boards; rearview cameras for vehicles;.

Its status is currently believed to be active. Its class is unavailable. “XSEMI” is believed to be currently owned by “XSEMI CORPORATION”.

Owner:
XSEMI CORPORATION
Owner Details
Description:
CMOS image sensor packaging in the nature of integrated circuit assembly; Semiconductor packaging in the nature of integrated circuit assembly; Manufacturing processing of semiconductors, wafers, and integrated circuits for others; Assembly of semiconductors, wafers, and integrated circuits for others; Packaging of semiconductors, wafers, and integrated circuits for others in the nature of integrated circuit assembly; Metal laminating; Laminating of plastic, metal, ceramic or glass sheets; Laminating of plastic sheets; Molding of plastic materials;Integrated circuit modules; Electronic integrated circuits; Circuit boards provided with integrated circuits; Semiconductor chips; Computer chips; Integrated circuit modules for use with infrared detectors; Chip carriers, semiconductor chip housings; Integrated circuits; Photoelectric sensors; Infrared sensors; Optical lenses; Optical mirrors; Printed circuit boards; Rearview cameras for vehicles;
Categories: CMOS IMAGE SENSOR PACKAGING