THERMOPLASTIC COMPOUNDS USEFUL IN MOLDING

Brand Owner Address Description
FULTON 404 SHPP GLOBAL TECHNOLOGIES B.V. PLASTICSLAAN 1 BERGEN OP ZOOM 4612 PX Netherlands THERMOPLASTIC COMPOUNDS USEFUL IN MOLDING, COATING AND OTHER APPLICATIONS;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. Techniques for reducing the mechanical stress imposed upon semiconductor dice by protective molding compounds during times of temperature fluctuation. A thermoplastic material is attached to a top surface of a die to relieve the stress. The thermoplastic material serves as a cushion between the die and the molding compound when the components expand and contract. The thermoplastic material can be shaped such that it does not cover bond pads on the surface of a die.