THERMAL MANAGEMENT COMPONENTS MICROELECTRONICS

Brand Owner Address Description
CHIPCHILL NUVOTRONICS, INC. 7586 OLD PEPPERS FERRY LOOP RADFORD VA 24141 Thermal management components for microelectronics, electronics and electrical components, namely, integrated circuit coolers, electronic device coolers, central processing unit (CPU) coolers, optoelectronic device coolers, microwave device coolers, RF device coolers in the nature of single-phase heater exchangers and dual-phase heat exchangers in the nature of heat pipes or vapor chambers used for cooling or delivery of gas or liquid for use by the aerospace and military, automotive, communications, electronics, information technology and biotechnology industries and in the manufacture of industrial and consumer products;CHIP CHILL;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. Where double sided circuit boards are utilized, having components on both sides, cooling is easily achieved by utilizing an appropriate thermal bonding agent which is both thermally conductive and electrically insulating. The thermal bonding agent is coupled to the circuit board in a manner which surrounds and encapsulates components on one side of the circuit board. Attached to the other side of the thermal bonding material is a heat sink, or other heat management device. By using this configuration, heat is easily transmitted from the electrical components to the heat sink, while not creating any electrical interference or shorts for circuit components in contact with the thermal bonding material.