SQUEEGEE

Brand Owner (click to sort) Address Description
CLER'ET HANCO, INC. P.O. BOX 1256 LAKE OSWEGO OR 97035 SQUEEGEE;
CLER'ET CLER'ET, INC. 18304 Westview Dr Lake Oswego OR 97034 squeegee;
SMOOTHEE T. K. Gray, Inc. 1812 S. 6TH ST. Minneapolis MN Squeegee;SMOOTHY;
SQEEGEE BEN TUNIS COMPANY, INC. Rye NY SQUEEGEE;CLEANING CLOTHS;
SQUEE GEE BILTRITE CORPORATION, THE 22 WILLOW ST. CHELSEA MA 02150 SQUEEGEE;Shoe Soles;
SQUEE-G Squee-G 3006 E. Megan St. Gilbert AZ 85295 SQUEEGEE;Medical devices, namely, drinking specify the type of aid, e.g., cups, bottles, straws, etc. for use by patients with disabilities and mobility difficulties; Medical devices, namely, drinking specify the container type, e.g., cups, bottles, etc. with extended straws for use by patients with a limited range of motion or use of hands to enable them to compress the drinking container with their leg or body and drink without having to bend over or stretch;Portable beverage container holders; Containers for housing bottled and canned liquids, namely, portable insulated beverage holders; Insulated beverage containers, namely, squeeze bottles sold empty;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A film carrier tape for mounting electronic part comprises an insulating film, a wiring pattern formed on a surface of the insulating film, and a solder resist layer formed by moving a squeegee using a screen mask of a prescribed pattern that is formed in such a manner that connecting terminal portions of the wiring pattern should be exposed. The edge of the solder resist layer is formed almost in parallel or almost at right angles to the moving direction of the squeegee used in the application of the solder resist. The solder resist layer can be formed by the use of a screen mask for solder resist coating in which the edge of the screen that is unmasked to apply the solder resist is formed almost in parallel or almost at right angles to the moving direction of the squeegee used in the application of the solder resist. According to the present invention, the fraction defective of the solder resist coating can be decreased.