SHADED RECTANGLE CARRIER

Brand Owner (click to sort) Address Description
TENIMENTI CIVA Civa Group Distribuzione S.r.l. STRADA NUOVA NAVIGLIO, 6 PARMA I-43122 Italy The trademark consists of the stylized wording TENIMENTI CIVA held within a shaded rectangle carrier.;TENIMENTI C I V A;Color is not claimed as a feature of the mark.;The English translation of the word TENIMENT in the mark is ESTATES.;Wine; piquette; wine-based cocktails and aperitifs; sparkling wines; sweet wines; sparkling fruit wines; wine-based drinks;TENIMENTI;
XSTRAP STANDARD Zhangjiagang SMK MFG. Co., Ltd. NO.3 Yuefeng Rd. Provincial Economic Development Zone Zhangjiagang 215600 China The mark consists of the stylized wording of XSTRAP STANDARD with the wording STANDARD inside a shaded rectangle carrier.;X STRAP STANDARD;Color is not claimed as a feature of the mark.;Bungee cords; Cargo and carrier equipment for vehicles comprised of synthetic textile materials, excluding artificial leather, namely, tow ropes, tow straps, ratchet tie-down straps, quick release tie down straps, lashing straps, and tarp straps; Nylon strapping or tie downs; Nylon tie down straps; Synthetic rope and webbing;STANDARD;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A semiconductor memory device formed on a semiconductor chip comprises a plurality of first memory arrays, a plurality of second memory arrays, a first voltage generator, and a plurality of first bonding pads. The semiconductor chip is divided into a first rectangle region, a second rectangle region, and a third rectangle region and the third rectangle region is arranged between the first rectangle region and the second rectangle region. The plurality of first memory arrays are formed in the first rectangle region. The plurality of second memory arrays are formed in the second rectangle region. The voltage generator and the plurality of first bonding pads are arranged in the third rectangle region. The plurality of first bonding pads are arranged between the first rectangle region and the voltage generator and no bonding pads are arranged between the voltage generator and the plurality of second memory arrays.