SEMICONDUCTOR WAFER PROCESSING SYSTEMS

Brand	Owner (click to sort)	Address	Description
RADIAN 3	Elemental Scientific, Inc.	7277 World Communications Drive Omaha NE 68122	Semiconductor wafer processing systems, namely, semiconductor wafer processing machines and parts therefor; Semiconductor wafer analysis systems, namely, semiconductor wafer processing equipment and parts therefor; Systems, namely, semiconductor wafer processing equipment for semiconductor wafer processing and analysis by means of phase decomposition; Equipment and systems, namely, semiconductor wafer processing equipment for semiconductor wafer processing and analysis;RADIAN THREE;
RADIAN 7	Elemental Scientific, Inc.	7277 World Communications Drive Omaha NE 68122	Semiconductor wafer processing systems, namely, semiconductor wafer processing machines and parts therefor; Semiconductor wafer analysis systems, namely, semiconductor wafer processing equipment and parts therefor; Systems, namely, semiconductor wafer processing equipment for semiconductor wafer processing and analysis by means of phase decomposition; Equipment and systems, namely, semiconductor wafer processing equipment for semiconductor wafer processing and analysis;RADIAN SEVEN;
RADIANVPD	Elemental Scientific, Inc.	7277 World Communications Drive Omaha NE 68122	Semiconductor wafer processing systems, namely, semiconductor wafer processing machines and parts therefor; Semiconductor wafer analysis systems, namely, semiconductor wafer processing equipment and parts therefor; Systems, namely, semiconductor wafer processing equipment for semiconductor wafer processing and analysis by means of phase decomposition; Equipment and systems, namely, semiconductor wafer processing equipment for semiconductor wafer processing and analysis;RADIAN VAPOUR PHASE DECOMPOSITION;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

A method used to form a semiconductor device comprises processing a semiconductor wafer to include one or more vias or through-holes only partially etched into the wafer, and scribe marks only partially etched into the wafer which define a plurality of semiconductor devices. Wafer material is removed from the back of the wafer to the level of the vias and scribe marks to form a via opening through the wafer while simultaneously dicing the wafer into individual semiconductor dice.