SEMICONDUCTOR INGOTS

Brand Owner Address Description
AMETEK AMETEK, INC. 1100 Cassatt Road Berwyn PA 19312 [ Semiconductor Ingots, Wafers and Chips With and Without Electronic Circuits Diffused Thereon; ] Gas Analysis and Control [ Instruments; ] Instruments to Measure, Control and Record Pressure, Temperature, Flow and Level; [ Electronically-Controlled Undersea Work Vessel Systems Comprising Submersible Vehicles with Winches, Control Cables, Vessel Propulsion Units, Television Cameras, and Remotely-Controlled Work Arms; and Acoustic Products-Namely, Sonar and Doppler Sensors, Docking Units, and Navigational Aids ];[ Expansion Joints; Bellows; Diaphrams; Straining and Filtering Screens for Pipelines; Manually Operated Ball Valves; ] [ Corrosion Resistant Tanks for Storage and Transportation; and Tower Bases for Industrial Equipment, and Piping and Fittings Thereof ];[ Temperature Resistant Fabrics ];[ Epoxy Adhesives ];Heat Exchangers; [ Thermal Solar Collecting Systems Comprising Collectors, Photovoltaic Cells, Modules, Panels and Arrays; and Heating and Air Conditioning Systems Based on Solar Collection-Namely, Heat Exchangers, Fan Coils, Boilers and Cold Water Storage Tanks ];[ Silicon Wafer-Reclaiming Services; and Marine and Underwater Engineering, Insulating and Design Services ];The drawing is lined for the color red.;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A method of production of large Ingots of neutron attenuating composites using a vacuum-bellows system allows for large cross-sectional shapes to be extruded and rolled. This method uses a vacuum-bellows technology which allows the manufacturing of large 8-16 inch diameter ingots (50-450 lbs. each). A variety of primary metal matrix materials can be used in this technology. High specific strength and stiffness can be achieved because the technology allows for final densities of 99% and higher. The vacuum-bellows technology allows metals and ceramics to blend and mesh together at compression pressures of 800 tons with elevated temperatures. The controlled compression movement allows for any oxide layer, on the metal, to be broken up and consolidated with the chosen ceramic particulate.