RESIN CORE METALLIC SOLDER

Brand Owner Address Description
POCKET-PAK NORTHRUP GRUMMAN SYSTEMS CORPORATION (SUCCESSOR BY MERGER TO LITTON INDUSTRIES,INC.) 1840 CENTURY PARK EAST LOS ANGELES CA 90067 Resin Core Metallic Solder;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A mold type semiconductor device includes a semiconductor chip including a semiconductor part; a metallic layer; a solder layer; and a metallic member connecting to the semiconductor chip through the metallic layer and the solder layer. The solder layer is made of solder having yield stress smaller than that of the metallic layer. Even when the semiconductor chip is sealed with a resin mold, the metallic layer is prevented from cracking.