QUANTUM SHIELDS

Brand	Owner (click to sort)	Address	Description
QUANTUM SHIELDZ	EYL Inc.	#401, 52, Singu-ro, Giheung-gu Yongin-si, Gyeonggi-do 16971 Republic of Korea	QUANTUM SHIELDS;financial services in the field of payment provided over the Internet, namely, payment verification services, bill payment services provided through a website, credit card payment processing services; transaction verification services, namely, check verification, payment verification services, funds verification services; person-to-person financial services in the field of payment via electronic communications, namely, processing of electronic wallet payments, electronic payment services involving electronic processing and subsequent transmission of bill payment data; e-wallet payment services, namely, bill payment services provided via an electronic wallet, processing of electronic wallet payments; electronic processing of credit card, debit card, electronic wallet payments;
QUANTUM SHIELDZ	EYL Inc.	#401, 52, Singu-ro, Giheung-gu Yongin-si, Gyeonggi-do 16971 Republic of Korea	QUANTUM SHIELDS;development of IT security software; decryption of data; data encryption and decoding services; design and development of electronic data security systems; design and development of programs for computers; design of integrated circuits; development of computer hardware; data security services, namely, data security consultancy, computer security threat analysis for protecting data, data encryption services for providing security and anonymity for electronically transmitted credit card transactions; development of computer software for security management;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

Particle flaking is reduced in a semiconductor wafer processing apparatus by installing a chamber shield assembly in the chamber of the apparatus. The shield assembly includes a plurality of nested shields that are supported out of contact with each other and suspended such that, during thermal expansion and contraction, gaps are maintained that are sufficient to avoid arcing. Alignment structure on the shields and on the chamber walls force the shields to align concentrically and maintain the gaps. The shields are made of aluminum or another thermally conductive material and have cross-sectional areas large enough to provide high thermal conductivity throughout the shields. Mounting flanges and other mounting surfaces are provided on the shields that form intimate thermal contact with sufficient contacting area to insure high thermal conductivity from the shields to the temperature controlled walls of the chamber. Radiant lamps of an array are spaced around the chamber and extend vertically to expose multiple shields across large areas to heat for pre-heating bake-out of the shields and to eliminate thermal shock upon processing the first wafer of a run.