PROTECTIVE PADS USE

Brand Owner (click to sort) Address Description
LIFTCOLLAR STEWART, ROBIN 2826 DENBY AVE. LOS ANGELES CA 90039 Protective pads for use in sports, namely, a padded collar worn around the neck to protect the collar bones and neck area during weightlifting;LIFT COLLAR;
OVERPROTECTIVE.... ....AND PROUD OF IT! Team Wendy Building 1 17000 St. Clair Avenue Cleveland OH 44110 Protective pads for use in non-athletic protective clothing, namely, helmets [, knee protectors, and elbow protectors ];
SHIN PAL Vidpro International, Inc. P.O. Box 825 Pittsfield VT 05762 protective pads for use in soccer play;SHIN;
WHAT'S INSIDE YOUR HELMET? Team Wendy Building 1 17000 St. Clair Avenue Cleveland OH 44110 Protective pads for use in non-athletic protective clothing, namely, helmets;WHAT IS INSIDE YOUR HELMET?;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. Methods for packaging microelectronic devices, microelectronic workpieces having packaged dies, and microelectronic devices. One aspect of the invention is directed toward a microelectronic workpiece comprising a substrate having a device side and a backside. In one embodiment, the microelectronic workpiece further includes a plurality of dies formed on the device side of the substrate, a dielectric layer over the dies, and a plurality of bond-pads on the dielectric layer. The dies have integrated circuitry and a plurality of bond-pads electrically coupled to the integrated circuitry. The ball-pads are arranged in ball-pad arrays over corresponding dies on the substrate. The ball-pads of one array, for example, are electrically coupled to the bond-pads of the corresponding die. The microelectronic workpiece of this embodiment further includes a protective film over the dielectric layer. In one embodiment, the workpiece further includes solder balls attached to corresponding ball-pads, and the protective film covers the dielectric layer in between the solder balls. The solder balls in this embodiment also have exposed contact sites such that the protective film can cover side portions of the solder balls but not a top surface of the solder balls.