PROTECTIVE PADS

Brand Owner (click to sort) Address Description
CCUBED ZEPHYROS, INC. 160 McLean Drive Romeo MI 48065 Protective pads, namely, protective pads for workers;Safety padding for hockey, lacrosse, and football; shin pads for use in sports;CUBED;Multi-layer fabric for use in the manufacture of clothing, footwear and head-wear;
DING MAT Scribner, William N. 819 Newington Avenue Baltimore MD 21217 protective pads, namely, foam pads for magnetic attachment to a vehicle;
DURIBILKNIT JOHN B. FLAHERTY CO., INC. BRONX NY PROTECTIVE PADS, KNEE PADS, HAND PADS, FOREARM PADS, AND KARATE PADS;DURABLEKNIT;ATHLETIC SUPPORTERS, AND KNEE SUPPORTS;
FLARICO JOHN B. FLAHERTY CO., INC. BRONX NY PROTECTIVE PADS, KNEE PADS, HAND PADS, FOREARM PADS AND KARATE PADS;KNEE SUPPORTS;
MARTIAL ARMOR CENTURY 2410 West Aero Park Court Traverse City MI 49686 protective pads, namely, elbow pads, forearm pads, hand pads, shin pads, foot and instep pads, chest pads, [ and headgear, ] all for use in martial arts, mixed martial arts, judo, boxing and all forms of martial arts, hybrid martial arts and individual contact sports of a similar kind;Armor;
WEB SAVER Keeper Corporation 6 Industrial Park Drive North Windham CT 06256 Protective pads, namely, plastic pads that slip over cargo straps to protect the cargo straps from wear;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. Methods for packaging microelectronic devices, microelectronic workpieces having packaged dies, and microelectronic devices. One aspect of the invention is directed toward a microelectronic workpiece comprising a substrate having a device side and a backside. In one embodiment, the microelectronic workpiece further includes a plurality of dies formed on the device side of the substrate, a dielectric layer over the dies, and a plurality of bond-pads on the dielectric layer. The dies have integrated circuitry and a plurality of bond-pads electrically coupled to the integrated circuitry. The ball-pads are arranged in ball-pad arrays over corresponding dies on the substrate. The ball-pads of one array, for example, are electrically coupled to the bond-pads of the corresponding die. The microelectronic workpiece of this embodiment further includes a protective film over the dielectric layer. In one embodiment, the workpiece further includes solder balls attached to corresponding ball-pads, and the protective film covers the dielectric layer in between the solder balls. The solder balls in this embodiment also have exposed contact sites such that the protective film can cover side portions of the solder balls but not a top surface of the solder balls.