PRINTED BOARD ASSEMBLIES

Brand Owner Address Description
GENCAM Institute for Interconnecting and Packaging Electronic Circuits, The 2215 Sanders Road Northbrook IL 600626135 BOOKLETS PROVIDING DATA TRANSFER STANDARDS RELATED TO MANUFACTURING PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. Structures and techniques for mounting semiconductor dies are disclosed. In one embodiment, the invention includes a stack of printed wiring board assemblies that are connected via interconnection components. At least one of the printed wiring board assemblies includes an interposer substrate having a constraining layer that includes carbon.