PREPARATION IN TABLET FORM FOR

Brand Owner (click to sort) Address Description
BLUE ANGEL H. J. Hawley Chemical Company, Inc. Stockton CA PREPARATION IN TABLET FORM FOR USE AS A GERMICIDE, ALGAECIDE, BACTERICIDE, AND FUNGICIDE;
DIREXIN AMERICAN HOME PRODUCTS CORPORATION New York NY PREPARATION IN TABLET FORM FOR TEMPORARY RELIEF OF PAIN DUE TO SIMPLE HEADACHE AND MINOR NEURALGIA;
LUCKY-POP KELLOGG, EDWARD S. 685 S. CARONDELET ST. LOS ANGELES CA PREPARATION IN TABLET FORM FOR MAKING SOFT DRINKS;
NETHAPHYL RICHARDSON-MERRELL, INC. Wilton CT PREPARATION IN TABLET FORM FOR USE IN THE TREATMENT OF ALLERGIC AND CARDIOVASCULAR CONDITIONS;
NIKOBAN J. B. WILLIAMS COMPANY, INC., THE New York NY Preparation in Tablet Form for Use as a Smoking Deterrent;
REPRIEVE FREDERICK S. MAYER, DOING BUSINESS AS MAYER LABS 587 THORNWOOD TERRACE SAN RAFAEL, CALIF. PREPARATION IN TABLET FORM FOR THE RELIEF OF PAINS DUE TO OVERINDULGENCE;
SYLVASUN SYLVACHEM (PROPRIETARY) LIMITED PREPARATION IN TABLET FORM FOR THE PREVENTION OF AND RELIEF OF SUNBURN;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. To provide a method of producing an encapsulating molding material tablet by which adhesion of an encapsulating molding material to the punch surface of a tablet forming machine can be reduced, an encapsulating molding material tablet produced by this method, and an electronic part apparatus equipped with an element encapsulated using this encapsulating molding material tablet. A method of producing an encapsulating molding material tablet in which a release agent dissolved in a solvent is fed to the punch surface of a tablet forming machine to form a release agent layer having a thickness of over 0.001 ?m and less than 0.07 ?m on the above-mentioned punch surface, then, an encapsulating molding material is fed to the above-mentioned tablet forming machine for molding the material, an encapsulating molding material tablet produced by this method or having a contact angle ratio of 1.15 or more and less than 1.35, and an electron part apparatus equipped with an element encapsulated using this encapsulating molding material tablet.