NET BALLS

Brand Owner (click to sort) Address Description
GAGALILEO Liu, Xinzhi Rm 701, Un 1, Bldg. 41, No. 37 JiuShuiDo Qingdao City 266100 China Net balls; Nets for badminton; Nets for ball games; Nets for ice hockey goals; Nets for sports; Sport balls; Baseball batting cage nets; Basketball nets; Billiard nets; Butterfly nets; Golf practice nets; Hand-held fishing nets; Platform tennis nets; Racquet ball nets; Soccer ball goal nets; Table tennis nets; Tennis nets; Volleyball nets;
SENMERY ZENG, QINGXIONG Zengjia Group, Dongfeng Village Wenqiao Town, Yunxi District Yueyang, Hunan 414000 China Net balls; Squash balls; Squeeze toys; Stand-up paddleboards; Stress relief exercise balls; Strings for rackets; Stuffed toy bears; Surf boards; Surf paddles; Table tennis balls; Toy cars; Toy construction blocks; Toy masks; Wind-up toys; Yoga boards;The wording Senmery has no meaning in a foreign language.;
YIMZUDHI Hangzhou yimudi Technology Co., Ltd. Rm.1445, Hongshan Zhongzhi Pioneer Park, Nanyang Street, Xiaoshan District, Hangzhou, Zhejiang 311227 China Net balls;
ZEKVUNY Quanzhou Tao Tu E-commerce Co., LTD Room 1402, No.1, Kaixuan Mingmen 134 Fengli Street Shishi, Fujian 362251 China Net balls; Rackets and strings for rackets; Racquet ball nets; Sports equipment, namely, telescoping caddy for bucket for carrying, storing and transporting tennis balls and other sports equipment; Tennis nets and uprights; Tennis racket covers; Tennis rackets; Tennis racquets; Tennis racquets, baseball bats, cricket bats, golf clubs and hockey sticks; Vibration dampeners for tennis rackets;The wording zekvuny has no meaning in a foreign language.;
 

Where the owner name is not linked, that owner no longer owns the brand

   
Technical Examples
  1. A method of packaging an integrated circuit die includes the steps of loading an array of soft conductive balls into recesses formed in a platen and locating the platen in a first part of a mold cavity. A second part of the mold is pressed against the balls to flatten a surface of the balls. A first mold compound then is injected into the mold cavity such that the mold compound surrounds exposed portions of the balls. The balls are removed from the platen and a first side of an integrated circuit die is attached to the balls. Die bonding pads on a second side of the die are electrically connected to respective ones of the balls surrounding the die, and then the die, the electrical connections, and a top portion of the conductive balls is encapsulated with a second mold compound.