NAME PLATES

Brand Owner (click to sort) Address Description
87-D PANELGRAPHIC CORPORATION KULICK ROAD CALDWELL, N.J. NAME PLATES;SCIENTIFIC EQUIPMENT-NAMELY, INSTRUMENT AND CONSOLE PANELS, DIALS AND CALIBRATED SCALES;87 D;
MASTER PHOTO MASTER ETCHING CORPORATION 50 HONECK ST. ENGLEWOOD, N.J. NAME PLATES, DIALS AND PANELS HAVING A DYE-IMPREGNATED OXIDE COATING USED FOR METAL SPECIALTIES SUCH AS ADVERTISING, LICENSE PLATES, AND INSIGNIA, AND AS DATA PLATES FOR MACHINES, APPLIANCES, VEHICLES, AND SHIPS;
NAME FRAMES HALL, JERRY L. 12807 GLORIA COURT CHESTER VA 23831 NAME PLATES;
NAMETTES V.H. SWENSON CO., INC. KEARNEY NJ NAME PLATES;
NAMETTES BERGLUND-SWENSON CO., INC. 154 ELM ST. ARLINGTON NJ NAME PLATES;
P PANELGRAPHIC CORPORATION KULICK ROAD CALDWELL, N.J. NAME PLATES;SCIENTIFIC EQUIPMENT-NAMELY, INSTRUMENT AND CONSOLE PANELS, DIALS, CALIBRATED SCALES;
TEXTUR TOUCH C.A.M. Graphics Co., Inc. 145 Toledo St. Farmingdale NY 11735 Name Plates, Information Panels, Dials, Scales, Touch-Type Switches and Touch-Type Panels Made of Metal, Plastic and Glass, With and Without Electrical Connections, for All Electrical and Electronic Devices Requiring Identification and Information Panels;Applicant disclaims Touch apart from the mark as a whole.;TEXTURE TOUCH;
TT C.A.M. Graphics Co., Inc. 145 Toledo St. Farmingdale NY 11735 Name Plates, Information Panels, Dials, Scales, Touch-Type Switches and Touch-Type Panels Made of Metal, Plastic and Glass, With and Without Electrical Connections, for All Electrical and Electronic Devices Requiring Identification and Information Panels;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A process chamber includes an opening, two or more stacked cold plates adjacent the opening, two or more stacked hot plates adjacent the cold plates, and a rotatable wafer transport capable of moving a wafer between the cold plates and between the hot plates for processing of the wafer. The wafer can be rapidly heated while between the hot plates. The wafer transport has perpendicular walls about a pivot such that when the wafer is between the cold plates or between the hot plates, one of the walls separates the cold and hot portions, thereby increasing the efficiency of cooling and heating.