METAL SPUTTERING TARGETS METAL

Brand	Owner	Address	Description
SCI ENGINEERED MATERIALS	SCI Engineered Materials, Inc.	30b northwest ave., suite 210 2839 Charter St. tallmadge OH 44278	metal sputtering targets and metal backing plates therefor;ENGINEERED MATERIALS;non-metal sputtering targets and non-metal backing plates therefor;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

A barrier layer is formed in an integrated circuit by providing a metal target near a ceiling of the chamber and a wafer support pedestal facing the target near a floor of the chamber. A process gas is introduced into the vacuum chamber. A target-sputtering plasma is maintained at the target to produce a stream of principally neutral atoms flowing from the target toward the wafer for vapor deposition. A wafer-sputtering plasma is maintained near the wafer support pedestal to produce a stream of sputtering ions toward the wafer support pedestal for re-sputtering. The sputtering ions are accelerated across a plasma sheath at the wafer in a direction normal to a surface of the wafer to render the sputter etching highly selective for horizontal surfaces.