INTEGRATED CIRCUITS WITH TOLERANCE

Brand Owner (click to sort) Address Description
RAD BAE SYSTEM INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC. 65 Spit Brook Road Nashua NH 03060 INTEGRATED CIRCUITS WITH A TOLERANCE FOR RADIATION SOLD TO THE DEFENSE, AVIONICS AND SPACE MARKETS;RADIO;
RAD5500 BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC. NHQ1-719 PO Box 868 Nashua NH 030610868 Integrated circuits with a tolerance for radiation;RAD 5500;
RAD5510 BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC. NHQ1-719 PO Box 868 Nashua NH 030610868 Integrated circuits with a tolerance for radiation;RADIATION 5510;
RAD5515 BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC. NHQ1-719 PO Box 868 Nashua NH 030610868 Integrated circuits with a tolerance for radiation;RADIATION 5515;
RAD5545 BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC. NHQ1-719 PO Box 868 Nashua NH 030610868 Integrated circuits with a tolerance for radiation;RAD 5545;
RAD6000 BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC. NHQ1-719 PO Box 868 Nashua NH 030610868 INTEGRATED CIRCUITS WITH A TOLERANCE FOR RADIATION SOLD TO THE DEFENSE, AVIONICS AND SPACE MARKETS;RADIO 6000;
RAD750 BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTERGRATION INC. 65 Spit Brook Road Nashua NH 03060 INTEGRATED CIRCUITS WITH A TOLERANCE FOR RADIATION SOLD TO THE DEFENSE, AVIONICS AND SPACE MARKETS;RADIO 750;
RH45 BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC. NHQ1-719 PO Box 868 Nashua NH 030610868 Integrated circuits with a tolerance for radiation;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. The invention provides a sealing layer that seals metal bonding structures between three dimensional bonded integrated circuits from a surrounding environment. A material may be applied to fill a volume between the bonded integrated circuits or seal the perimeter of the volume between the bonded integrated circuits. The material may be the same material as that used for underfilling the volume between the bottom integrated circuit and a substrate.