INSPECTION APPARATUS DETECTING OR

Brand	Owner	Address	Description
SHAPED ENERGY	AMERICAN SCIENCE AND ENGINEERING, INC.	829 Middlesex Turnpike Billerica MA 01821	INSPECTION APPARATUS FOR DETECTING OR CHARACTERIZING MATERIALS OR PERSONS THROUGH THE USE OF PENETRATING RADIATION, NOT USED FOR MEDICAL PURPOSES, AND INSTRUCTIONAL MANUALS SOLD AS A UNIT THEREWITH;PROVIDING MAINTENANCE SERVICES IN CONNECTION WITH INSPECTION APPARATUS FOR DETECTING OR CHARACTERIZING MATERIALS OR PERSONS THROUGH THE USE OF PENETRATING RADIATION;ENERGY;TECHNICAL SUPPORT SERVICES NAMELY TROUBLESHOOTING OF INSPECTION APPARATUS FOR DETECTING OR CHARACTERIZING MATERIALS OR PERSONS THROUGH THE USE OF PENETRATING RADIATION; PROVIDING CONSULTING SERVICES IN CONNECTION WITH INSPECTION APPARATUS FOR DETECTING OR CHARACTERIZING MATERIALS OR PERSONS THROUGH THE USE OF PENETRATING RADIATION;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

A substrate inspection apparatus 1-1 (FIG. 1) of the present invention performs the following steps of: carrying a substrate "S" to be inspected into an inspection chamber 23-1; maintaining a vacuum in said inspection chamber; isolating said inspection chamber from a vibration; moving successively said substrate by means of a stage 26-1 with at least one degree of freedom; irradiating an electron beam having a specified width; helping said electron beam reach to a surface of said substrate via a primary electron optical system 10-1; trapping secondary electrons emitted from said substrate via a secondary electron optical system 20-1 and guiding it to a detecting system 35-1; forming a secondary electron image in an image processing system based on a detection signal of a secondary electron beam obtained by said detecting system; detecting a defective location in said substrate based on the secondary electron image formed by said image processing system; indicating and/or storing said defective location in said substrate by CPU 37-1; and taking said completely inspected substrate out of the inspection chamber. Thereby, the defect inspection on the substrate can be performed successively with high level of accuracy and efficiency as well as with higher throughput.