HIGH CAPACITY ELECTRONIC

Brand Owner (click to sort) Address Description
ARCTICBLUE Spectra Logic Corporation 6285 Lookout Road Boulder CO 80301 High capacity electronic, disk-based data storage libraries sold blank offering secondary data storage capacity and associated instructional user guides sold as a unit;ARCTIC BLUE;
NTIER VERDE Spectra Logic Corporation 6285 Lookout Road Boulder CO 80301 High capacity electronic, disk-based data storage libraries sold blank offering secondary data storage capacity and associated instructional user guides sold as a unit;The English translation of the word VERDE in the mark is GREEN.;VERDE;
VERDE Spectra Logic Corporation 6285 Lookout Road Boulder CO 80301 High capacity electronic, disk-based data storage libraries sold blank offering secondary data storage capacity and associated instructional user guides sold as a unit;The English translation of VERDE in the mark is GREEN.;
VERDE DP Spectra Logic Corporation 6285 Lookout Road Boulder CO 80301 High capacity electronic, disk-based data storage libraries offering secondary data storage capacity and associated instructional user guides sold as a unit;
VERDE DPE Spectra Logic Corporation 6285 Lookout Road Boulder CO 80301 High capacity electronic, disk-based data storage libraries sold blank offering secondary data storage capacity and associated instructional user guides sold as a unit;The English translation of VERDE in the mark is GREEN.;VERDE;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. An electronic assembly comprising one or more high performance integrated circuits includes at least one high capacity heat sink. The heat sink, which comprises a number of fins projecting substantially radially from a core, is structured to capture air from a fan and to direct the air to optimize heat transfer from the heat sink. The heat sink fins can be formed in different shapes. In one embodiment, the fins are curved. In another embodiment, the fins are bent. In yet another embodiment, the fins are curved and bent. Methods of fabricating heat sinks and electronic assemblies, as well as application of the heat sink to an electronic assembly and to an electronic system, are also described.