HEAT SINKS

Brand Owner (click to sort) Address Description
MICROLOOPS Taiwan Microloops Corp. Zhonghe Dist. 16F.-4, No. 150, Jian 1st Rd. New Taipei City R.O.C. Taiwan Heat sinks, heat pipes and vapor chambers all for use in electronic components, computer equipment, electronic equipment and electronic products; Cooling units, cooling modules and cooling boards all for use in electronic components, computer equipment, electronic equipment and electronic products; and Heat-dissipation modules for use in server, graphic card, telecom and LED industry;MICRO LOOPS;The wording MICROLOOPS has no meaning in a foreign language.;
OPTIPIN AAVID ENGINEERING, INC. One Eagle Square, Suite 509 Concord NH 03301 heat sinks;OPTIC PIN;
SURE-FORM AOS Thermal Compounds 22 Meridian Road, Suite 6 Eatontown NJ 07724 HEAT SINKS, COMPRISED PRIMARILY OF GREASE BLOCKS, FOR USE IN COMPUTERS BETWEEN ELECTRONIC COMPONENTS AND ELECTRONIC CIRCUIT BOARDS;
THERMKON SHERBROOKE CORPORATION 36490 READING AVENUE Willoughby OH 44094 HEAT SINKS;METAL SHAPES FOR USE IN THE FURTHER MANUFACTURE OF FINISHED GOODS;
TITAN TITAN TECHNOLOGY, INC. 22805 Savi Ranch Parkway, Suite B Yorba Linda CA 92887 heat sinks, electrical fans and other cooling devices for personal computers, peripherals and components;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A heat dissipation device includes a first heat sink (10) mounted on one side of a video graphics adapter (VGA) card (70) on which a heat generating componnent is mounted to dissipate heat generated by the heat generating componnent, a second heat sink (10') mounted on an opposite side of the card, a pair of heat pipes (40) independent from and intercrossed with each other and connected between the first and second heat sinks for transferring heat from the first heat sink to the second heat sink, a pair of covers (26) attached on the respective first and second heat sinks to form enclosed channels (15) between the covers and the first and second heat sinks respectively, a pair of fans (22) mounted between the covers and the first and second heat sinks for producing airflow through the channels to improve heat dissipation efficiency of the heat dissipation device.