FLEXIBLE PADS

Brand Owner (click to sort) Address Description
FLEX - PADS INTERNATIONAL SOFT TISSUE PROSTHESES Mandelkern, Isabel (NMI) 8833 West 75th Street Overland Park KS 66212 flexible pads;prostheses for missing body parts; namely, external soft tissue throughout the entire body;INTERNATIONAL and SOFT TISSUE PROSTHESES;
KLEIN'SCHE Bernhard Klein Hermann-Helms-Straße 15 Bremen 28279 Germany Flexible pads, rests or foils, namely, sleeping pads and seating pads containing magnets, for therapeutic purposes: plasters, namely, medical plasters, therapeutic plasters, and magnetic medical and therapeutic plasters;Sleep masks;Textiles and textile products, namely, towels, bed covers, bed linen, pillow cases, the aforesaid goods, including with magnets;The English translation of KLEIN'SCHE in the mark is OF KLEIN.;Surgical apparatus and instruments; medical, dental and veterinary apparatus and instruments, namely, magnetic medical activation of blood system and lymph system devices, magnetic medical detoxication of cells devices and magnetic medical relaxation devices for treating medical ailments; massage apparatus; face, body and foot massage apparatus, whirlpool massage apparatus for medical use and Therapeutic use, inhalation apparatus, namely, magnetic inhalation devices for treating oxygen inhalation problems, pulse measuring apparatus, fertility measuring apparatus, namely, pulse measuring apparatus, heartbeat measuring apparatus, and medical instruments for measuring fetal heart rates, blood analysis apparatus, namely, blood testing apparatus, blood sugar measuring apparatus, sphygmomanometers, hearing aids, infrared lamps for medical purposes, electric heating and warming apparatus, namely, heating pads for medical purposes, heated cushions for medical purposes and therapeutic purposes, orthopaedic articles of all kinds, namely, orthopedic insoles for medical purposes; bed mattresses, in particular heated or unheated medical and orthopaedic bed mattresses; fitted mattress covers for heated or unheated medical and orthopaedic bed mattresses, the aforesaid goods containing magnets or magnetic inserts and being for therapeutic purposes; heated blankets for medical purposes, orthopaedic support bandages, orthopaedic elastic bandages, and orthopaedic compression bandages, orthopedic insoles for medical purposes, magnetic pillows for medical purposes, fitted bed covers for therapeutic beds for medical purposes; all aforesaid goods in particular including with magnetic inserts or magnets for medical purposes, orthopedic floor cushions for medical purposes, seating wedges for medical purposes, back rests for medical purposes; massage balls, including containing magnets; magnets for medical use, magnet arrays, namely, apparatus for magnetic therapy for medical use, orthopedic magnetic soles, longlife magnets for therapeutic purposes; seats containing magnetic inserts or magnets for medical purposes;
MAXX BRADY WORLDWIDE, INC. 6555 West Good Hope Road Milwaukee WI 53223 Flexible pads, tubular socks, pillows, sheets, rolls and elongated blankets for controlling and absorbing oil, grease, and fluids, for domestic, commercial and industrial use;MAX;
RESCUE BRADY WORLDWIDE, INC. 6555 West Good Hope Road Milwaukee WI 53223 flexible pads, laboratory pads, tubular socks, pillows, and elongated blankets for controlling and absorbing hazardous materials and industrial waste products including hazardous materials;absorbent particulate use for controlling and absorbing hazardous materials and industrial waste products;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A high density electronic circuit for use in an implantable stimulation device that comprises a flexible substrate that has the advantage of integrating "chip-and-wire" microelectronic circuits and flexible interconnections that are adapted to conform to the body compatible housing into a single structure. The flexible substrate has die attach pads, each die attach pad having a set of wire bond pads therearound, each wire bond pad being connected to conductors formed within the substrate according to circuit function. A plurality of chip-and-wire integrated circuit (IC) chips are mounted by epoxy die attachment on the die attach pads, each IC chip has a plurality of contact pads formed on a top surface thereof, and gold wire bonds electrically connect the plurality of contact pads to the wire bonds pads. The wire bonds include a primary bond and, optionally, a safety bond for reinforcement. Other techniques are disclosed to enable the use of the gold wire bonds on a flexible substrate.