EPOXY RESIN USE WITH

Brand Owner Address Description
105 EPOXY RESIN GOUGEON BROTHERS, INC. 100 Patterson Avenue Bay City MI 48707 Epoxy resin for use with hardener for general coating and laminating purposes in building, restoration, and repair applications;Epoxy resin for use with hardener for general bonding and filling purposes in building, restoration, and repair applications;EPOXY RESIN;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. The present invention provides an epoxy resin composition for packaging a semiconductor device, characterized in having improved mold releasability during a molding process, continuous-moldability and improved solder resistance. According to the present invention, there is provided an epoxy resin composition for packaging the semiconductor element, obtained by formulating: (A) an epoxy resin; (B) a phenolic resin; (C) a curing accelerator; (D) an inorganic filler; and (E) an oxidized polyethylene wax having a drop point within a range of from 60 to 140 degree C., an acid value within a range of from 10 to 100 (mg KOH/g), a number average molecular weight within a range of from 500 to 20,000, and a mean particle size within a range of from 5 to 100 ?m, wherein at least one of (A) epoxy resin and (B) phenolic resin is a novolac structured resin having biphenylene structure, and wherein content of (E) oxidized polyethylene wax in epoxy resin composition is within a range of from 0.01 to 1 % wt.