ELECTRONIC CHIPS

Brand Owner (click to sort) Address Description
ALWAYS ON WIFI Silicon Laboratories Inc. 400 W. CESAR CHAVEZ Austin TX 78701 Electronic Chips, Electronic Modules, and Electronic systems for Wireless Communications using Wireless Local Area Network communication protocols; Low Power Chips with advanced power saving features for Wireless Local Area Network communications;
ESP Espressif Systems (Shanghai) Co., Ltd. RM 204 BLDG 2 NO 690 BIBO RD PUDONG DIST SHANGHAI 201203 China Electronic chips; integrated circuits; data processing apparatus; computer software, recorded; semiconductor apparatus; printed circuits; chips [integrated circuits]; computer memory devices; smart cards [integrated circuit cards]; printed circuit boards; all of the foregoing excluding computer software for use in connection with data processing and data management;Technical research; computer software design; updating of computer software; consultancy in the design and development of computer hardware; information technology [IT] consultancy; research and development of new products for others; computer programming; maintenance of computer software; computer software consultancy; outsource service providers in the field of information technology; all of the foregoing excluding computer services related to computer software for use in connection with data processing and data management;
OMTERELEC Yueqing Oumu Teer Electronic & Technology Co., Ltd. No. 16, Yonghe 2 Road, China Electronic chips; circuit breakers; connections, electric; high and low voltage switchboard; integrated circuits; switches, electric; electric plugs; electron tubes; potentiometers; electronic devices for measuring electric current;OMTER ELEC;
OMTERELEC Yueqing Omter Electronic & Technology Co., Ltd. No. 16, Yonghe 2 Road, China Electronic chips; circuit breakers; connections, electric; high and low voltage switchboard; integrated circuits; switches, electric; electric plugs; electron tubes; potentiometers; electronic devices for measuring electric current;OMTER ELEC;
SENSIRION Sensirion AG Laubisruetistrasse 50 8712 Staefa Switzerland Electronic chips, integrated circuits; electronic chips featuring integrated sensors; sensors being measuring apparatus other than for medical use, namely, pressure sensors, gas sensors, pollutant sensors, optical sensors, temperature sensors, heat sensors, hygrometers, humidity sensors, mass flow sensors, gas flow sensors, fluid flow sensors, differential pressure sensors; measuring instruments and apparatus, namely, flow meters; computer software for driving sensor hardware, sensor data processing, sensor performance evaluation, sensor data logging, use in mobile phones, use in wearable devices, use in embedded devices, use in digital signal processing; computer application software for sensor data processing, sensor performance evaluation, sensor data logging, sensor application development; computer application software for mobile telephones for sensor data processing, displaying sensor data, logging and storing data, use in compensating disturbances, use in fitness tracking, use in navigation, use in breath quality detection, use in air quality measuring and treatment, use in environmental temperature and humidity measuring;The wording SENSIRION has no meaning in a foreign language.;Development of chips comprising integrated sensors, detecting devices, sensor systems, transmitters and control systems; research in the field of electronic chips comprising integrated sensors, detecting devices, sensor systems, transmitters and control systems; software development services; cloud computing featuring software for use as an information service, providing services improving sensor data quality, storing and retrieving sensor data, fitting sensor data to physical models, merging sensor data with third party data sources, detecting user context based on sensor data, improving the quality of future sensor products; consulting services in the field of cloud computing;
TANAOR D & M Magali Ltd. 1 Jabotinsky St Ramat Gan 5252001 Israel Electronic chips, namely, nano patterned silicon dies; electronic chips in the nature of nano patterned silicon dies containing the Bible or other religious scriptures; electronic chips in the nature of nano patterned silicon dies containing miniaturized scanned copies of the Bible or other religious scriptures;Money clips; money clips with electronic chips embedded therein; money clips with electronic chips containing the Bible or other religious scriptures; pens; pens with electronic chips embedded therein; pens with electronic chips containing the Bible or other religious scriptures; bookmarks; ornamental bookmarks; bookmarks with electronic chips embedded therein; bookmarks with electronic chips containing the Bible or other religious scriptures;Jewelry; jewelry items including pendants, rings, bracelets, earrings, cufflinks, tie clips and ornamental lapel pins; jewelry with electronic chips embedded therein; jewelry with electronic chips containing the Bible or other religious scriptures; medals and medallions; medals and medallions with electronic chips embedded therein; medals and medallions with electronic chips containing the Bible or other religious scriptures; keyholders of precious metals; ornamental keyholders of precious metals; keyholders made of precious metals; keyholders of precious metals with electronic chips embedded therein; keyholders of precious metals with electronic chips containing the Bible or other religious scriptures;The wording TANAOR has no meaning in a foreign language.;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. Apparatus and methods are provided for integrating microchannel cooling modules within high-density electronic modules (e.g., chip packages, system-on-a-package modules, etc.,) comprising multiple high-performance IC chips. Electronic modules are designed such that high-performance (high power) IC chips are disposed in close proximity to the integrated cooling module (or cooling plate) for effective heat extraction. Moreover, electronic modules which comprise large surface area silicon carriers with multiple chips face mounted thereon are designed such that integrated silicon cooling modules are rigidly bonded to the back surfaces of such chips to increase the structural integrity of the silicon carriers.