CONNECTION INTERCONNECTION DEVICES

Brand Owner (click to sort) Address Description
MINITWIN APTIV SERVICES 5 US 5725 INNOVATION DRIVE TROY MI 48098 Connection and interconnection devices, namely, electrical, electronic, [ optical and electro-optical connectors; ] components of such connectors, namely, electric contacts, electric pins, electric sockets, [ optical ferrules, ] electrical connector housings and fastening elements for connectors;MINI TWIN;
PWR PROFILE+ AMPHENOL FCI ASIA PTE. LTD. 159 Kampong Ampat, #04-01 KA Place Singapore 368328 Singapore Connection and interconnection devices of all kinds, namely electrical, electronic, optical and electro-optical connectors; components of such connectors, namely contact terminals and housings;POWER PROFILE PLUS;Color is not claimed as a feature of the mark.;POWER;
RCK800 APTIV SERVICES 5 US 5725 INNOVATION DRIVE TROY MI 48098 Connection and interconnection devices of all kinds, namely electric, electronic, optical and electro-optical connectors; components of such connectors, namely contact terminals and casings; all these goods intended for the automotive field;RCK 800;
RCK890 APTIV SERVICES 5 US 5725 INNOVATION DRIVE TROY MI 48098 Connection and interconnection devices of all kinds, namely electric, electronic, optical and electro-optical connectors; components of such connectors, namely contact terminals and casings; all these goods intended for the automotive field;RCK 890;
SENSOMATE Delphi International Operations Luxembou Avenue de Luxembourg L-4940 Bascharage Luxembourg Connection and interconnection devices of all kinds, namely, electrical, electronic, optical and electro-optical connectors; components of such connectors, namely, contact terminals and containers;SENSOR MATE;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A routing method of a semiconductor device includes steps (a) to (c). The step (a) checks a relation between a first interconnection pattern to be routed and a second interconnection pattern to be routed, wherein a line width of the second interconnection pattern is thicker than that of the first interconnection pattern. The step (b) refers to a routing rule of a design rule corresponding to a connection between the first interconnection pattern and the second interconnection pattern, when the first interconnection pattern and the second interconnection pattern would be routed in a same layer and connected each other. The step (c) routes the first interconnection pattern and the second interconnection such that the first interconnection is not bent in an area defined based on the routing rule.