CONDUCTIVE SOLUTION WITH METAL PARTICLES

Brand Owner Address Description
LIQUID FOIL NATIONAL SECURITY SYSTEMS, INC. 1261 South Lyon Street Suite 402 Santa Ana CA 92705 CONDUCTIVE SOLUTION WITH METAL PARTICLES FOR PROVIDING CIRCUITRY IN AN ALARM SYSTEM;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A method for dispersing and fixing particles on the bumps of a chip using an electrophoresis technology is provided. The particles and chip bumps are processed to carry charges by applying chemical bonding between metal and thiol with electric charges. The chip is placed in a reactor with a solution along with the conductive particles. The conductive particles are then migrated and fixed to the bonding locations on the bumps of a chip through an electrophoresis procedure. For conductive particles not carrying charges, they can sink naturally to the surface of chip bumps due to their higher density than water in the solution. An electroplating procedure is then applied to fix the conductive particles onto the bump.