COMPOUNDS FOR BUFFING POLISHING

Brand	Owner (click to sort)	Address	Description
BUFF-EEZ	SWIMC, INC.	PO BOX 657 NEWARK DE 197150657	COMPOUNDS FOR BUFFING AND POLISHING PAINTED SURFACES;BUFF-EASE;
MUNNING & MUNNING	KURTS & WOLFE CHEMICAL CO., INC.	960 CLOSE AVE. 10472 BRONX NY 10472	COMPOUNDS FOR BUFFING AND POLISHING METALS, PLASTICS, AND SIMILAR MATERIALS;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

A method for chemical mechanical polishing (CMP) wafers having high aspect ratio surface topography. A wafer is positioned on a plate. A polishing pad is coupled to a platen. A polishing solution (e.g., slurry) is added between the polishing pad and the wafer. CMP is performed on the wafer by creating a relative movement between the polishing pad and the wafer. The polishing pad removes substantially all residual material from the channels. To accomplish this, the polishing pad has a compressibility of at least 5% at a polishing pressure of about 4 psi.