CLEANSING POLISHING PREPARATIONS

Brand Owner (click to sort) Address Description
FALL IN LOVE WITH YOUR HOME ALL OVER AGAIN! david Cavill 7040 key haven road unit 606 Seminole FL 33777 Cleansing and polishing preparations; Floor polishes; Floor wax; Furniture polishes; General purpose cleaning, polishing, and abrasive liquids and powders; Leather polishes; Leather preserving polishes; Liquid floor polishes; Polish for furniture and flooring;
GELERATION JESSICA COSMETICS INTERNATIONAL, INC. 12309 Saticoy Street North Hollywood CA 91605 Cleansing and polishing preparations; Cleansing creams; [ False nails; ] Gel for nail sculpting; Glue removers; Nail buffing preparations; Nail care preparations; [ Nail grooming products, namely, tips, glue, lacquer and glitter; ] Nail polish; Nail polish base coat; Nail polish removers; Nail polish top coat; [ Nail tip; ] Color gel nail polish; Gel nail polish base coat; Gel nail polish removers;
GRAPHIX WAX LIFE INDUSTRIES CORPORATION 4060 Bridgeview Drive North Charleston SC 29405 Cleansing and polishing preparations; Polishing wax;GRAPHIC WAX;WAX;
SANG SÉVEN Qianyu, Luo 493 Marc pl unit A Azusa CA 91702 Cleansing and polishing preparations; Cleansing milk; Facial beauty masks; Makeup setting sprays; Body cream; Cologne; Cosmetic masks; Cosmetic mud masks; Cosmetic pencils; Eye cream; Eyebrow pencils; Eyeliner pencils; Face and body glitter; Face glitter; Facial cleansing milk; Facial sheet masks for cosmetic use; Hand cream; Lip cream; Make-up; Nail enamels; Night cream; Skin cleansing cream; Skin cleansing lotion; Skin cream; Skin masks; Skin softeners; Sunscreen cream; Tissues impregnated with make-up removing preparations; Waterproof makeup;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A method for chemical mechanical polishing (CMP) wafers having high aspect ratio surface topography. A wafer is positioned on a plate. A polishing pad is coupled to a platen. A polishing solution (e.g., slurry) is added between the polishing pad and the wafer. CMP is performed on the wafer by creating a relative movement between the polishing pad and the wafer. The polishing pad removes substantially all residual material from the channels. To accomplish this, the polishing pad has a compressibility of at least 5% at a polishing pressure of about 4 psi.