CLEANING COMPOUNDS NAMELY

Brand Owner (click to sort) Address Description
ADMIRATION SARAMAR CORPORATION Cannon Building, Suite 145 861 Silver Lake Boulevard Dover DE 19901 Cleaning Compounds-Namely, a Hand Pot, Pan and Dish Cleaner;
ATTACK SARAMAR CORPORATION Cannon Building, Suite 145 861 Silver Lake Boulevard Dover DE 19901 Cleaning Compounds-Namely, an Alkaline Laundry Builder;
CHECKMATE SARAMAR CORPORATION Cannon Building, Suite 145 861 Silver Lake Boulevard Dover DE 19901 Cleaning Compounds-Namely, a Dishwashing Compound for Use in Mechanical Dishwashing Machines;
CORONET SARAMAR CORPORATION Cannon Building, Suite 145 861 Silver Lake Boulevard Dover DE 19901 Cleaning Compounds-Namely, a Hand Dishwashing Detergent;
EMPRESS Consolidated Foods Corporation Middleton WI CLEANING COMPOUNDS-NAMELY, DISHWASHING, UPHOLSTERY AND RUG CLEANING, AND AUTOMOBILE, WALL, FLOOR AND OTHER HARD SURFACE CLEANING COMPOUNDS;
HERALD Consolidated Foods Corporation Middleton WI CLEANING COMPOUNDS-NAMELY, A DISHWASHING DETERGENT FOR USE IN MECHANICAL DISHWASHING MACHINES;
MAGIC MAN Trott; Richard L. 5840 S. 76th East Ave. Tulsa OK 74141 Cleaning Compounds-Namely, Upholstry Cleaner for Color-Fast Fabrics, Vinyl and Other Plastic, Leather, Carpets, Metal, Chrome, Wood; and Whitewall Cleaner and Degreaser for White or Blackwalls of Tires;
SCHALK'S RED DEVIL, INC. Suite 750 1437 S. Boulder Avenue Tulsa OK 74119 CLEANING COMPOUNDS-NAMELY, WAX AND GREASE REMOVERS, PAINT BRUSH CLEANERS, PAINT AND VARNISH REMOVERS;SCHALKS;
SUPPORT SARAMAR CORPORATION Cannon Building, Suite 145 861 Silver Lake Boulevard Dover DE 19901 Cleaning Compounds-Namely, a Laundry Detergent Builder and Wetting Agent;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A post-etch residue cleaning composition for cleaning ashed or unashed aluminum/SiN/Si post-etch residue from small dimensions on semiconductor substrates. The cleaning composition contains supercritical CO2 (SCCO2), alcohol, fluoride source, an aluminum ion complexing agent and, optionally, corrosion inhibitor. Such cleaning composition overcomes the intrinsic deficiency of SCCO2 as a cleaning reagent, viz., the non-polar character of SCCO2 and its associated inability to solubilize species such as inorganic salts and polar organic compounds that are present in the post-etch residue and that must be removed from the semiconductor substrate for efficient cleaning. The cleaning composition enables damage-free, residue-free cleaning of substrates having ashed or unashed aluminum/SiN/Si post-etch residue thereon.