CHIP CAPACITORS

Brand Owner (click to sort) Address Description
U S MICROTEK COMPONENTS U.S. CAPACITOR CORPORATION 2151 LINCOLN ST. BURBANK CA 91504 Chip Capacitors, Leaded Capacitors, and Frequency Filters Primarily Used for Suppression of Electromagnetic Interference (EMI) and Radio Frequency Interference (RFI);No claim is made to the exclusive right to use U S; Components, apart from the mark as shown.;US MICROTECHNICAL COMPONENTS;
US MICROTEK COMPONENTS AVX CORPORATION One AVX Boulevard Fountain Inn SC 29644 Chip Capacitors, Leaded Capacitors, and Frequency Filters Primarily Used for Suppression of Electromagnetic Interference (EMI) and Radio Frequency Interference (RFI);No claim is made to the exclusive right to use US; Components, apart from the mark as shown.;The drawing is lined to indicate the blue in the letters U and S and the color red in the lines comprising the logo.;
 

Where the owner name is not linked, that owner no longer owns the brand

   
Technical Examples
  1. A chip module element having an array of capacitors, a planar interconnect structure coupled to the array of capacitors, and a multilayer circuit structure coupled to the planar interconnect structure. The planar interconnect structure includes a plurality of conductive elements (e.g., z-connections and conductive posts) electrically communicating the capacitors and the multilayer circuit structure. A plurality of conductive pins is coupled to the multilayer circuit structure. The array of capacitors is capable of being charged by providing an electrical current which passes from the pins, through the multilayer circuit structure, through the conductive elements, and to the capacitors. A method for making a chip module element comprising forming an array of capacitors, electrically testing the capacitors in the array to determine which capacitors are defective and which are acceptable, and storing data of the defective capacitors in an information storage medium. The method further includes forming an interconnect structure on the array of capacitors, wherein the interconnect structure includes a plurality of conductive elements, and wherein the conductive elements are electrically coupled to the acceptable capacitors.