CARRYING CASES SPECIFICALLY DESIGNED

Brand Owner (click to sort) Address Description
ANDA & MASHA Anda & Masha 80 N. Moore Street, 20-F New York NY 10013 carrying cases specifically designed for mobile computers, cellular telephones, smart phones, personal digital assistants, tablet computers, handheld personal computers and portable electronic apparatus, namely, wireless cellular phone headsets, headphones, computer pointing apparatus and speakers;men's, women's and children's clothing, namely t-shirts; sweatshirts; jeans; sweatpants; shirts; pants; sweaters; underwear; panties; bras; undershirts; sleepwear; pajamas; lingerie; robes; nightgowns; jackets; rainwear; raincoats; swimwear; bathing suits; cover ups; dresses; coats; shorts; suits; ties; blouses; vests; gloves; scarves; mufflers; head bands; shoes; hats; belts; shawls; scarves; ponchos; shoulder wraps; socks; stockings; hosiery; tights; leggings; and leotards;ANDA AND MASHA;
CHICAGO CASE CO. Chicago Case Co. 4446 S. Ashland Ave. Chicago IL 60609 [ carrying cases specifically designed to carry computers, computer discs, and tapes ];non-metal tool cases in the nature of tote cases sold empty and polyethylene travel cases sold empty for carrying a variety of tools;CASE CO.;
ROMAN GADGETS AURELIUS INTERNATIONAL 11157 Provencal Pl. San Diego CA 92128 CARRYING CASES SPECIFICALLY DESIGNED FOR STORAGE AND TRANSPORTATION, NAMELY, CARRYING CASES FOR TABLET COMPUTERS AND HANDHELD COMPUTERS; STANDS USED FOR TABLET COMPUTERS;GADGETS;
 

Where the owner name is not linked, that owner no longer owns the brand

   
Technical Examples
  1. The present invention provides a low cost device that has a true die to external fiber optic connection. Specifically, the present invention relates to an optical device package joined to a semiconductor device package. In some cases, the combination is joined using wirebond studs and an adhesive material. In other cases, the combination is joined using an anisotropic conductive film. Yet, in other cases, the combination is joined using solder material. Each of these joining mechanisms provides high levels of thermal, electrical and optical performance. The joining mechanisms can apply to optical sub-assembly and chip sub-assembly interfaces in transceivers, transmitters, as well as receivers for opto-electronic packages.