CAPPING MACHINES

Brand Owner (click to sort) Address Description
A.C.T DWK LIFE SCIENCES 1501 N 10th St Millville NJ 08332 capping machines, power-operated crimpers;ACT; AUTOMATIC CRIMPING TOOLS;
ACCUCAPPER Accutek Packaging Equipment Company, Inc. 2980 Scott St Vista CA 92081 Capping machines; Capping machinery; Power-operated capping devices in the nature of bottle cappers for inserting caps on bottles; Bottle capping systems, namely, bottle capping machines;ACCURATE CAPPER;
BELT-KAP Auto-Mate of Florida Corp. 217 North Seacrest Blvd., #1028 Boynton Beach FL 33425 Capping machines;BELT-CAP;
BELT-KAPPER Auto-Mate of Florida Corp. 217 North Seacrest Blvd., #1028 Boynton Beach FL 33425 Capping machines;BELT-CAPPER;
BELTORQUE NJM Packaging Inc 5600 Kieran Montreal, Quebec H4S 2B5 Canada Capping machines;BELT TORQUE;
BELTORQUE JALBERT AUTOMATISATION INC. 5060 AMBROISE-LAFORTUNE STREET BOISBRIAND J7H1S6 Canada Capping machines;BELT TORQUE;
KAPR PAX IP INC. 5605 Rue Cypihot Saint-Laurent, QC H4S1R3 Canada Capping machines;
NEWTRY Feng, Quan Jinding residential area,Wanrong County Yuncheng 044200 China Capping machines; Cutting machines; Electric jacks; Electric pumps; Hydraulic jacks; Hydraulic pumps; Pneumatic pumps; Pneumatic shears; Punching machines; Punching presses for metalworking; Shears, electric; Stands for hydraulic jacks; Vacuum pumps;NEW TRY;
RELIA-CAP Kinex Cappers 6B Columbia Drive Amherst NH 03031 Capping machines;RELIABLE CAP;
TOPS THEM ALL RESINA AUTOMATIC MACHINERY CO., INC. CAPPING MACHINES;
VERSA-MAX Kinex Cappers 6B Columbia Drive Amherst NH 03031 Capping machines;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A method for fabricating a capping layer with enhanced barrier resistance to both copper and oxygen diffusion, comprises forming a capping layer on a conductive surface of an interconnect, wherein the capping layer comprises cobalt (Co), tungsten (W), rhenium (Re), and at least one of phosphorus (P) and boron (B). In an embodiment of the invention, forming the capping layer comprises exposing the conductive surface to an electroless capping solution comprising a cobalt source, a tungsten source, a rhenium source, and at least one of a phosphorus source and a boron source, and annealing the capping layer.