BUILDING BOARDS NOT METAL

Brand Owner Address Description
FUNDO PLANO WEDI GmbH Hollefeldstr.51 Emsdetten 48282 Germany Building boards (not of metal) and flooring, especially for wet areas, including showers with integrated drain; building materials not of metal, pipes, not of metal for building; asphalt, pitch and bitumen; transportable buildings not made of metal, stone, included in this class; tile coverings, not of metal; tiles, not of metal; partly processed timber in the form of profiles, boards, sheets, blocks, rods;Building boards (of metal) and flooring, especially for wet areas, including showers with integrated drain; metal building materials, including semi-finished tube and profile form of metal for building; pipes and tubes of metal; support feet, supports, spacers, safety, connecting and mounting hardware and brackets made of metal (included in this class), protection and ventilation gratings of metal; accessories for installation of wall and floor coverings, namely frames, rails, brackets, profiles on the distinction between wall and floor coverings, all goods from metal, stair nosings and profiles to the mount of balconies or terraces, all articles of metal, door frames, namely the door frame and poles made of metal and metal window frames, drain seals, pipes, drains and traps made of metal, tile coverings of metal; plates (tiles) from metal;Apparatus for lighting, heating, steam generating, cooking, refrigerating, drying, ventilating, water supply and sanitary, water supply systems, bathing- and shower-systems, namely, shower cubicles, bath and shower containers, included in this class;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. Reflow soldering of a variety of circuit boards (9, 11, 15) in a variety of sizes and shapes to assigned locations on the base or carrier (13) of the electronic module housing (3) is simplified by eliminating custom made metal blocks previously used to clamp the circuit boards against the carrier metal. Instead, the solder-backed circuit boards are placed in assigned positions in the module housing and the inside volume of that housing is filled (22) with particulate, such as small beads (17), covering the circuit boards, but leaving the edges of the upstanding metal shields (5 and 7) visible. A plate (21) backed foam sheet (19) is placed over the module housing (24) and clamped down (26), pressing against the beads. The clamped assembly is then heated (28) to reflow the solder, soldering the circuit boards in place.