ATTACHABLE

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Technical Examples
  1. A substrate is provided for packaging a microelectronic device having a pattern of contacts on the surface thereof. The substrate is formed from a support member having a substantially planar surface, and first, second, and third electrically conductive paths. The electrically conductive paths each extends from a corresponding device-attachable region on the substantially planar surface. The third device-attachable regions are each substantially equidistant to the first and second device-attachable regions. In addition, the device contact pattern may correspond spatially to a pattern formed by the first and third device-attachable regions or by the second and third device-attachable regions may form a second pattern. Also provided is a method for attaching a microelectronic device to a substrate. The invention is particularly suited for use in forming packages having a flip-chip configuration.