ALL AS RAW MATERIALS

Brand Owner (click to sort) Address Description
ALKEST OXITENO S.A. INDÚSTRIA E COMÉRCIO 7th Floor
BR
São Paulo
Brazil
Chemical and non-ionic surfactants, sorbitan esters, ...
ALKOLAN OXITENO S.A. INDÚSTRIA E COMÉRCIO 7th Floor
BR
São Paulo
Brazil
Amphoteric, non-ionic, cationic and anionic surfactants, ...
ALKOMOL OXITENO S.A. INDÚSTRIA E COMÉRCIO 7th Floor
BR
São Paulo
Brazil
Non-ionic surfactants, ethoxylated and propoxylated fatty ...
ALKONAT OXITENO S.A. INDÚSTRIA E COMÉRCIO 7th Floor
BR
São Paulo
Brazil
Non-ionic surfactants, fatty alcohol, fatty acids, ...
ALKOPON OXITENO S.A. INDÚSTRIA E COMÉRCIO 7th Floor
BR
São Paulo
Brazil
Biodegradable anionic surfactants, fatty alcohol sulfate, ...
ALKOSYNT OXITENO S.A. INDÚSTRIA E COMÉRCIO 7th Floor
BR
São Paulo
Brazil
Non-ionic surfactants, ethoxylated alcohol, synthetic alcohol ...
GLICENAT OXITENO S.A. INDÚSTRIA E COMÉRCIO 7th Floor
BR
São Paulo
Brazil
Oleochemicals, glycerin, glycerol, ethoxylated glycerin ...
NEOMINOX OXITENO S.A. INDÚSTRIA E COMÉRCIO 7th Floor
BR
São Paulo
Brazil
Amphoteric, non-ionic, cationic and anionic surfactants, ...
OXIMULSION OXITENO S.A. INDÚSTRIA E COMÉRCIO 7th Floor
BR
São Paulo
Brazil
Non-ionic and anionic surfactants, ethoxylated alcohols ...
OXITAINE OXITENO S.A. INDÚSTRIA E COMÉRCIO 7th Floor
BR
São Paulo
Brazil
Amphoteric, non-ionic, cationic and anionic surfactants, ...
ULTRAPEG OXITENO S.A. INDÚSTRIA E COMÉRCIO 7th Floor
BR
São Paulo
Brazil
Non-ionic surfactants, polyethylene glycol and polyalkylene ...
ULTRARIC OXITENO S.A. INDÚSTRIA E COMÉRCIO 7th Floor
BR
São Paulo
Brazil
Non-ionic surfactants, ethoxylated and propoxylated copolymer, ...
 

Where the owner name is not linked, that owner no longer owns the brand

   
Technical Examples
  1. Method and structure for optimizing dual damascene patterning with polymeric dielectric materials are disclosed. Certain embodiments of the invention comprise polymeric sacrificial light absorbing materials ("polymer SLAM") functionalized to have a controllable solubility switch wherein such polymeric materials have substantially the same etch rate as conventionally utilized polymeric dielectric materials, and subsequent to chemical modification of solubility-modifying protecting groups comprising the SLAM materials by thermal treatment or in-situ generation of an acid, such SLAM materials become soluble in weak bases, such as those conventionally utilized to remove materials in lithography treatments.