Pac Tech - Packaging Technologies GmbH

3.5 D

Treatment of materials by thermal, optical and mechanical interaction in relation to substrates used in the field of microelectronics, in particular semiconductor substrates and flexible substrates, namely, optical radiation, laser radiation;Machines, machine tools and power tools for manufacturing of multifunctional-microelectromechanical and microoptoelectromechanical systems for the manufacture of transponders and semiconductor wafers and integrated circuits affixed thereto; bonding machines and bonding machine tools for assembly of electrical, mechanical and optical components for the manufacture of transponders, sensors and semiconductor wafers, and integrated circuits affixed thereto; machines, machine tools and power tools in the field of microperipheric technologies, namely, autogenous soldering machines, electric welding machines, gas welding machines, electric brazing machines, sintering machines for chemical processing, all for manufacturing micro and non-scale structures by the transformation of solder, welding, brazing, adhesive-bonding or sintering materials; machines, machine tools and power tools for applying connecting materials in form of pre-forms, pastes, films, foils, fluids or powder onto substrates by using chemical, electro-chemical and physical deposition techniques, namely, machinery for applying coatings ultrasonically to medical and industrial apparatus; machines, machine tools and power tools for manufacturing microconnections, by chemical or physical deposition, mechanical-, thermal- or optical transformation; machines for electrical, optical and mechanical bonding to build up substrate units composed of one substrate or several substrates combined together to form a module, in particular chips; motors and engines, other than for land vehicles; machine couplings and transmission components, other than for land vehicles; devices in relation to micro-peripheral technologies, namely, machines for manufacture and processing of semi-conductors; apparatus, namely, electrostatic coating machines for applying connecting materials onto substrates, by using chemical, electro-chemical and physical deposition, dispense, placement and mechanical-, thermal- and optical transformation for manufacturing microconnections, in particular for building up substrate units composed of one substrate or several substrates combined together to form a module, in particular chips;Common metals and their alloys, unwrought or semi-wrought; transportable buildings of metal; non-electric cables and wires of common metal; metal containers for storage and transport; contact metallizations for micro joints of soldering in the nature of solder pastes, soft solder films, foils, fluids and powder;THREE . FIVE D;Industrial analysis of goods or services of others to assure compliance with industry standards and scientific research services; design and development of computer hardware and software; product development in the field of contact pad metallizations for connection technology; development of new technology for others in the field of the manufacture of microconnections; technological consultancy, in the technology field of the manufacture of microconnections;

PACTECH MEMBER OF NAGASE GROUP

Material treatment of substrates used in the field of microelectronics, in particular semiconductor substrates and flexible substrates;The mark consists of the following: a red circle containing a grid of red squares and the letters PT formed by white squares, the wording PACTECH in blue and outlined in black, and the wording MEMBER OF NAGASE GROUP in red.;Mechanical apparatuses, in particular automatic machines, with regard to microperipheric technologies, namely, semiconductor wafer processing machines; mechanical apparatuses, in particular automatic machines, for the application of connecting materials on substrates; mechanical apparatuses, in particular automatic machines, for manufacturing microconnections, in particular for the production of substrate units from one or more substrates joined as one module, in particular chips;Contact metalizations for microconnections made from soldering material, included in class 6, namely, soldering wire of metal for microconnections;PAC TECH MEMBER OF NAGASE GROUP;The color(s) red, blue, white and black is/are claimed as a feature of the mark.;MEMBER AND GROUP;[ Development of contact metallizations for connection systems, namely, new product development for others regarding contact metallization; development of connection systems for manufacturing microconnections, namely, development of new technology for others in the field of computer systems for microconnection manufacturing; technology consulting services, in particular with regard to manufacturing microconnections, namely, consulting services in the field of designing of machines for manufacturing microconnections and in the field of development of new technology regarding microconnection manufacturing and applicability ];