ENTHONE-OMI INC.

CIRCUITFIN

chemicals and chemical preparations used for surface conditioning of metal substrates in the electronic industry;

CUPRALITE

CUPRA LIGHT;chemical additives for plating bath solutions;

CUPRINT

chemical addition agents for use in copper plating processes;

ENSHIELD

Chemicals for Plating Metal onto Plastic and Metal Parts;

ENTHONE-OMI

computer services, namely, providing on-line information in the fields of decorative coatings, decorative precious metals, electroplating and coating chemistry for electronic components, and wear and corrosion resistant coatings through global computer networks connected by common protocols;

ENTHONE.OMI

computer services, namely, providing on-line information in the fields of decorative coatings, decorative precious metals, electroplating and coating chemistry for electronic components, and wear and corrosion resistant coatings through global computer networks connected by common protocols;The lining shown in the drawing is a feature of the mark and not intended to indicate color.;

EPOCH

horizontal conveyorized apparatus for use in connection with applying protective coatings to printed circuit boards;

EXCALIBUR

Chemical preparations for use in metal plating processes;

IMPACT

providing management assistance services to the printed wiring board industry regarding the supply and use of process materials and chemicals;

RESOLVE

chemical preparation for the cleaning and surface preparation of metal surfaces in the electroplating industry;

TEAMWORK ACROSS THE BOARD

business services, namely for providing products engineered for compatibility in the electronics industry, and for providing consultative and communication services related thereto;

TEAMWORK ACROSS THE BOARD

business services, namely for providing products engineered for compatibility in the electronics industry, and for providing consultative and communication services related thereto;

TEAMWORK ACROSS THE BOARD

newsletters and technical bulletins in the field of printed circuit board engineering, materials compatibility and fabrication;The stippling and lining are features of the mark and do not represent color.;

TEAMWORK ACROSS THE BOARD

newsletters and technical bulletins in the field of printed circuit board engineering, materials compatibility and fabrication;

UDYSTRIP

CHEMICAL COMPOSITION FOR REMOVING COATING FROM METAL SURFACES FOR INDUSTRIAL USE;

VENTURION

chemicals for use in metal plating processes;

VIABOND

VIA BOND;Chemicals for use in metal plating processes;

VIAFILL

VIA FILL;Chemicals for use in metal plating processes;

VIAPLATE

VIA PLATE;Chemicals for use in metal plating processes;