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PRINTED BACKSTAGE PASSES

BrandOwner (click to sort)
+44 Plus 44, Inc.
PLUS 44 Plus 44, Inc.
VH E.L.V.H., INC.
Technical Examples
  1. Mutilayer media is being developed which has inner ink-receiving micro-porous layer and an outer sealable porous surface coat, or topcoat. Ink printed on the media passes through the topcoat, and is absorbed by, or reacts with the inner ink-receiving layer. A thermal printhead is attached downstream of the print zone so that it passes over the area that was previously printed, and heats the topcoat. Where the topcoat is heated, the pores are closed and the closed pores provide a protective layer between the inner ink-receiving layer and the environment.
  2. A tamper protected printed circuit board assembly including a printed circuit board and a partially enveloping tamper wrap covering the entirety of the top surface of the printed circuit board and a first portion of the bottom surface of the printed circuit board, wherein a second portion of the bottom surface of the printed circuit board is not covered by the tamper wrap is provided. The printed circuit board includes two security trace layers each having two security traces thereon, preferably in a serpentine pattern. The tamper wrap and the security traces together cover and prevent tampering with the electronic circuitry of the printed circuit board.
  3. A manually activated, value-metering system having a method and an apparatus for achieving synchronization, wherein the value metering system uses a digital print head to print a plurality of printed lines, one printed line at a time, on a substrate, which is advanced through a print zone of the print head in a moving direction. A mechanical restraint is used to restrict the movement of the substrate through the print zone such that the substrate is allowed to move a fixed distance after the print head has printed one printed line until the last is printed. The fixed distance is substantially equal to the width of one printed line.
  4. The subject invention is an electrical connector system for a pair of printed circuit boards which utilizes a vertical female connector which is to be connected to one printed circuit board and a separate right angled male connector which has a housing which includes a plurality of right angled first electrically positive terminals which are to be used to connect to a second printed circuit board. Both printed circuit boards are connected together in a right angle relationship with one printed circuit board being located edgewise to the other printed circuit board. A mass of separate positive circuit paths is obtained by the terminals from one printed circuit board to the other. The vertical female connector and the right angled male electrical connector are fixedly mounted on their respective printed circuit boards.
  5. A printed circuit board and method for reducing the impedance within the reference path and/or saving space within the printed circuit board. In one embodiment of the present invention, a printed circuit board comprises a plurality of conductive layers. The printed circuit board further comprises two or more vias for interconnecting two or more conductive layers. The printed circuit board further comprises an electrical component embedded in a particular via between two conductive layers to reduce the impedance within the reference path and/or save space within the printed circuit board.

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