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PARCELS VIA GROUND
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Technical Examples
- A system and method (FIG. 1) for automated handling and identification of parcels sorted by an automated high-speed mail sorting apparatus that identifies parcels that contain hoax or biological threat material comprising an opener (120) and a particle sampler (170) wherein said sampler analyzes air flow created as the parcels are compressed by pinch rollers (140).
- A system and method for reliably detecting singulated parcels traveling on a conveyor belt by comparing parcel characteristics before and after parcel agitation. First, parcel characteristics are evaluated. Then parcels are agitated to promote a change in characteristics, for example volume or dimensions, of the unsingulated parcels. Next, parcel characteristics are again evaluated and compared to the previously-evaluated characteristics. If there is no appreciable difference in characteristics, the parcel is deemed singulated.
- A method for delivering and shipping parcels using a secure receptacle. The secure receptacle has an access device that controls a lock which is used to secure the contents of the receptacle from unauthorized access. One or more carriers are provided with authorized identification codes that are entered via the access device. Carriers can unlock the receptacle to place a parcel inside and then secure the receptacle to deliver the parcel whether a person is at the delivery location to receive the parcel or not. To ship a parcel, a sender places a parcel in the secure receptacle and notifies the carrier, who accesses the receptacle as described above. The carrier then takes the parcel and delivers it to the specified destination. When parcels are placed in or removed from the secure receptacle, a scanner positioned inside the secure receptacle reads a label on the parcel and sends the information to the carrier or a central processing station for the purposes of tracking parcels and payment transactions.
- The electrical bonding block with grounding lug includes a ground wire clamping chock which bears against the ground wire, clamping the ground wire between the chock and the ground wire passage. A ground wire clamp screw engages the chock to pull the chock tightly against the ground wire. This mechanism avoids direct point contact by the contact screw with the ground wire, thereby precluding the formation of nicks and stress risers in the ground wire and subsequent stress corrosion and/or fatigue failure of the ground wire. The device may be adapted to connect virtually any type of electrical conductors having separate ground elements, but is particularly well suited as a bonding block and ground lug for connecting two lengths of coaxial cable.
- A ground pad structure for preventing solder extrusion and a semiconductor package having the ground pad structure are disclosed, wherein the ground pad structure has the ground pads located along the circumference of its ground plane be formed in a non-solder mask defined manner. Accordingly, a good grounding quality is maintained, and the occurrence of the electrical bridging among the adjacent conductive traces can be avoided as the extrusion of the molten solder bumps from the ground pads located along the ground pad structure's circumference toward their adjacent conductive traces is effectively prevented.
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