THERMOPLASTIC THERMOSET RESINS USED

Brand Owner Address Description
BGA TESSERA, INC. 3025 Orchard Parkway San Jose CA 95134 thermoplastic and thermoset resins used for electronic computer chip packages; encapsulants and sealants made of silica and epoxy used as a protective coating for electronic components;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A golf ball comprising a single-layer core having a diameter of 0.10 inches to 1.50 inches, a PGA compression of 110 or less and, and comprising a copolymer of ethylene and an ?,?-unsaturated carboxylic acid, the acid being 100% neutralized by a salt of an organic acid, a cation source, or a suitable base of the organic acid; and a thermoplastic or thermoset cover comprising polyurethane, polyurea, epoxy resins, polyamides, polyesters, polycarbonates, or a copolymer comprising urethane and urea segments.