SOFT SQUEEZABLE BALLS

Brand	Owner (click to sort)	Address	Description
FLIX	THE TOPPS COMPANY, INC.	One Whitehall Street New York NY 10004	Soft squeezable balls; beach balls; plastic vinyl play balls; soft flying disks; squeeze toys; Christmas ornaments; bubble making wands and solution sets; dolls and magnetic doll sets consisting of flat magnetic dolls with flat magnetic articles of clothing and accessories; toy candy dispensers; arcade games; card games; trading card games; board games; plastic model kits; costume masks; toy figurines, poseable figurines, toy action figures and accessories therefor; toy vehicles; amusement park rides; pinball games; arcade-type electronic video games;Trading cards and stickers;
GARBAGE PAIL GANG	TOPPS COMPANY, INC., THE	One Whitehall Street New York NY 10004	Soft squeezable balls; beach balls; plastic vinyl play balls; soft flying disks; squeeze toys; ornaments for Christmas trees; bubble making wands and solution sets; dolls and magnetic doll sets consisting of flat magnetic dolls with flat magnetic articles of clothing and accessories; toy candy dispensers; arcade games; card games; trading card games; board games; plastic toy scale model kits; costume masks; toy figurines, poseable toy figurines, toy action figures and accessories therefor; toy vehicles; amusement park rides; pinball games; arcade-type electronic video games;
GPK	THE TOPPS COMPANY, INC.	One Whitehall Street New York NY 10004	Soft squeezable balls; squeeze toys; toy candy dispensers; arcade games; card games; trading card games; board games; costume masks; toy action figures and accessories therefor; toy vehicles; pinball games and arcade-type electronic video games;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

A method of packaging an integrated circuit die includes the steps of loading an array of soft conductive balls into recesses formed in a platen and locating the platen in a first part of a mold cavity. A second part of the mold is pressed against the balls to flatten a surface of the balls. A first mold compound then is injected into the mold cavity such that the mold compound surrounds exposed portions of the balls. The balls are removed from the platen and a first side of an integrated circuit die is attached to the balls. Die bonding pads on a second side of the die are electrically connected to respective ones of the balls surrounding the die, and then the die, the electrical connections, and a top portion of the conductive balls is encapsulated with a second mold compound.