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Brands and Their Owners
| Brand | Owner (click to sort) | Address | Description |
|---|---|---|---|
| ADAM | AZUR SPACE Solar Power GmbH | Theresienstrasse 2 74072 Heilbronn Germany | Semiconductor; semiconductor device, semiconductor device for solar cells and solar cell modules; solar cells; solar cells of III-V material, solar cells with multiple transitions; solar cell modules for generating electricity, solar cell modules for generating electricity with an array of solar cells; |
| ADAM | Azurspace Solar Power GmbH | Theresienstraße 2 74072 Heilbronn Germany | Semiconductor; semiconductor device, semiconductor device for solar cells and solar cell modules; solar cells; solar cells of III-V material, solar cells with multiple transitions; solar cell modules for generating electricity, solar cell modules for generating electricity with an array of solar cells; |
| CACTUS SEMICONDUCTOR | Cactus Semiconductor, Inc. | 60 N. McClintock Drive, Suite 1 Chandler AZ 85226 | SEMICONDUCTOR;design and development of integrated circuits; |
| CELIS SEMICONDUCTOR | Celis Semiconductor Corporation | 5475 Mark Dabling Boulevard, Suite 102 Colorado Springs CO 809183847 | SEMICONDUCTOR;technical consultation and research in the field of integrated circuit use and design of integrated circuits for others; |
| COTS PLUS | Aeroflex, Inc. | 975 Stewart Drive Sunnyvale CA 94085 | semiconductor; |
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| CROSSLAYER NETWORKS | Crosslayer Networks, Inc | 42840 Christy Street #205 Fremont CA 94538 | SEMICONDUCTOR;CROSS SLAYER NETWORKS;NETWORKS; |
| CROSSLAYER NETWORKS SILICON SOLUTIONS FOR TOMORROW'S NETWORKS | Crosslayer Networks, Inc. | 42840 Christy Street #205 Fremont CA 94538 | Semiconductor;SILICON SOLUTIONS FOR TOMORROWS NET WORKS;NETWORKS and SILICON; |
| DANEN | DANEN TECHNOLOGY CORP. | NO. 599, HUAN-NAN RD., GUANYIN TOWNSHIP TAOYUAN COUNTY Taiwan | SEMICONDUCTOR; SEMICONDUCTOR CHIP; SILICON WAFERS, NAMELY, A SOLAR CELL FABRICATED FROM THE ENTIRE WAFER; SOLAR BATTERIES; THIN-FILM SOLAR BATTERIES; SOLAR ENERGY ABSORBERS FOR CONVERSION OF SOLAR ENERGY TO ELECTRICAL CURRENT; SOLAR ENERGY CURRENT COLLECTOR PLATE FOR CONVERSION TO ELECTRICAL CURRENT; SOLAR POWER INVERTER;The wording DANEN has no meaning in a foreign language.; |
| DATA-LIT | LITRONIX, INC. | Cupertino CA | SEMICONDUCTOR, NUMERIC AND ALPHANUMERIC INDICATORS; |
| EFA | AZUR SPACE Solar Power GmbH | Theresienstrasse 2 74072 Heilbronn Germany | Semiconductor; semiconductor device, semiconductor device for solar cells and solar cell modules; solar cells; solar cells of III-V material, solar cells with multiple transitions; solar cell modules for generating electricity, solar cell modules for generating electricity with an array of solar cells; |
| EMPOWER SEMICONDUCTOR | Empower Semiconductor Inc. | 2700 Zanker Rd, Suite 168 San Jose CA 95134 | SEMICONDUCTOR;Design of semi-conductor circuits, integrated circuits, processors and memory chips; |
| HELIOS | A-trend Technology Co., Ltd. | Taipei Hsien, Taiwan China | semiconductor, integrated circuits, motherboards, interface cards and computer programs recorded; |
| IBEAM MATERIALS | iBeam Materials, Inc. | 2778A Agua Fria Street Santa Fe NM 87507 | Semiconductor, superconductor and dielectric substrates of glass, ceramics, metals, metal foils, metal tapes, plastic tapes, plastic foils, polymers, and wafers that are coated with crystal-aligned coatings of oxides, nitrides or metals for use as templates;I BEAM MATERIALS;MATERIALS; |
| JAZZ SEMICONDUCTOR | Specialtysemi, Inc. | 4311 Jamboree Road Newport Beach CA 92660 | SEMICONDUCTOR;Custom design in the field of semiconductor manufacture; and engineering in the field of semiconductor manufacture; |
| LITESER | LIMATE CORPORATION | 3F, NO. 62, WEN-HU STREET, NEI-HU TAIPEI Taiwan | semiconductor, diode, semiconductor transistor, semiconductor element; |
| MOBL | CYPRESS SEMICONDUCTOR CORPORATION | 198 Champion Court San Jose CA 95134 | Semiconductor; integrated circuits; and computer networking hardware; |
| POLYIC | PolyIC GmbH & Co. KG | Tucherstrasse 2 90763 Fürth Germany | Semiconductor, electrical, electronic and optical components, namely, electrical, electronic [ and optical switches, sensors, integrated circuits, capacitors, inductors, resistors, diodes, memory chips, data storage chips, transponder chips, blank electronic and optical data carriers, electronic and optical data carriers containing encoded and non-encoded data for identification and authentication of goods and documents and electronic products, for facilitating electronic communication, facilitating the exchange of information and for electronic signal processing, electronic and optical data carriers containing identification information such as serial numbers, device identification numbers and electronic communication addresses, solar cells, electrical and electronic switches and electronic circuits ] and also printed circuit boards; integrated circuits, [ active or passive electronic components, namely, transistors, diodes, resistors, capacitors, inductors, resistors, or integrated circuits; ] electrodes, electrical and electronic conductive paths, namely, conductive tracings on printed circuit boards and conductive tracings as part of electronic circuits, * except adhesives serving as electrodes or conductive paths *; conductive pads, namely, electric and electronic contact areas and electric and electronic conductors [ and electric and electronic sockets ] ; [ antennas, ] electrical and electronic operator control elements, namely, touch-sensitive and tactile operator control elements, namely, touchpads, touch sensors, touch screens, [ tactile switches and ] tactile sensors, for integration into electronic apparatus and into electronic devices for electronic hand-held apparatus, for portable and mobile communication devices, for portable audio and video players, for computers, for control devices, for electronic apparatus and machines; [ visual display elements, namely, electronic and optical displays as components for electronic devices and apparatus; light-emitting diodes and laser diodes * as assembly parts *, displays, namely, LCD displays, OLED displays, electrochromatic displays, electrophoretic displays; ] electrical components and electronic components and optical components and optoelectronic components and circuits, namely, [ electrical, electronic and optical switches, ] sensors, [ integrated circuits, capacitors, inductors, resistors, diodes, memory chips, data storage chips, transponder chips, blank electronic and optical data carriers, electronic and optical data carriers containing encoded and non-encoded data for identification and authentication of goods and documents and electronic products, for facilitating electronic communication, facilitating the exchange of information and for electronic signal processing, electronic and optical data carriers containing identification information such as serial numbers, device identification numbers and electronic communication addresses, solar cells, transistors * except optical measuring and lighting systems as well as laser systems for measuring purposes *; integrated circuits and components thereof; ] electrical functional layers and electronic functional layers, namely, completely and partially transparent and translucent electrodes and conductive paths; semiconductor components, electrical components, electronic components and optical components, namely, completely and partially transparent and translucent functional layers that are applied on flexible carrier substrates, the aforesaid functional layers consisting of non-conductive surface regions and conductive surface regions, whereas these conductive surface regions are in the form of conductive paths, conductive pads, matrix dots, grids and matrices of metal and of conductive polymers, * except conductive adhesives *; electrical functional layers and electronic functional layers, namely, non-conductive electrical structures and semi-conductive electrical structures and conductive electrical structures that are combined with electronic circuits and electronic components and applied on flexible carrier substrates; electrical and electronic functional layers, namely, [ printed organic electrical structures and ] inorganic electrical structures that are combined with electronic circuits and electronic components, * except conductive adhesives *; [ all the aforementioned goods also being codable and with optically active interference layers, polarization layers, liquid crystal layers, optically active three-dimensional structures; ] foil sheets, foil sheetings, [ foil tapes, foil tapes as roll goods, ] stickers, tags, [ tapes, filaments, discs, cards, boards and packaging, ] these goods containing semiconductor components, electrical components, electronic components and optical components, [ integrated circuits, ] electrodes, conductive tracings, electronic conductors, touch sensors, [ electronic displays, ] optical displays, LCD displays, OLED displays, [ electrochromatic displays, electrophoretic displays, ] sensors, [ data storage chips, ] electrical structures;Line 23, except adhesives serving as electrodes or conductive paths should be inserted after electronic circuits in class 9. Page 2, line 44, except conductive adhesives, except adhesives serving as electrodes or conductive paths and except adhesives in form of separated foils or separated films has been added to class 17. The following all aforementioned services not in relation with optical measuring and lighting systems, laser systems for measuring purposes, conductive adhesives should be inserted at the end of classes 42 and 45.;Semi-finished goods of plastics or primarily of plastics and semi-finished goods of polymers for manufacturing purposes, namely, for manufacturing stickers and labels, * except conductive adhesives *; [ bands of plastics or primarily of plastics, neither for medical purposes nor for household purposes, for manufacturing purposes, and bands of polymers, neither for medical purposes nor for household purposes, for manufacturing purposes; filaments of plastics or primarily of plastics not for textiles, for manufacturing purposes; discs, cards, boards of plastics and primarily of plastics and polymers for manufacturing purposes; ] foils primarily of plastics and foils of polymers for manufacturing purposes, foil sheets primarily of plastics and foil sheets of polymers for manufacturing purposes, foil sheetings primarily of plastics and foil sheetings of polymers for manufacturing purposes and [ foil tapes primarily of plastics and foil tapes of polymers for manufacturing purposes; ] foils primarily of plastics and foils of polymers for manufacturing purposes, foil sheets primarily of plastics and foil sheets of polymers for manufacturing purposes, foil sheetings primarily of plastics and foil sheetings of polymers for manufacturing purposes and foil tapes primarily of plastics and foil tapes of polymers for manufacturing purposes, these goods for receiving electrical functional structures, electrodes and conductive paths; semi-finished goods of plastics and primarily of plastics and semi-finished goods of polymers for manufacturing stickers and labels, * except conductive adhesives, * [ bands of plastics and bands primarily of plastics and bands of polymers for manufacturing purposes, filaments of plastics and filaments primarily of plastics and filaments of polymers, not for textiles, for manufacturing purposes, discs of plastics and discs primarily of plastics and discs of polymers for manufacturing purposes, cards of plastics and cards primarily of plastics and cards of polymers for manufacturing purposes, boards of plastics and boards primarily of plastics and boards of polymers for manufacturing purposes, ] foils primarily of plastics and foils of polymers for manufacturing purposes, foil sheets primarily of plastics and foil sheets of polymers for manufacturing purposes, foil sheetings primarily of plastics and foil sheetings of polymers for manufacturing purposes, [ foil tapes primarily of plastics and foil tapes of polymers for manufacturing purposes, ] all these goods containing non-conductive and semi-conductive and conductive functional layers for use as electronic circuits and electronic components, * except adhesives serving as electrodes or conductive paths *; [ semi-finished goods and components of plastics and primarily of plastics and polymers, namely, completely and partially transparent and translucent functional layers for manufacturing electronic functional layers, transparent and translucent electrodes and conductive paths; ] semi-finished goods of plastics or primarily of plastics and polymers, namely, completely or partially transparent and translucent functional layers on flexible carrier substrates with non-conductive surface regions and conductive surface regions, the conductive surface regions particularly in the form of conductive paths, conductive pads, matrix dots, grids and matrices also of metal and conductive polymers; [ stamping foils, hot-stamping foils, cold-stamping foils, transfer foils and laminating foils and also foil strips, primarily of plastics not for packaging purposes; stamping foils not for packaging purposes, hot-stamping foils, cold-stamping foils, transfer foils except for packaging purposes, comprising a carrier film, primarily of plastic and at least one transfer layer which can be detached from the carrier film for the purpose of application to a substrate; laminating foils, comprising a carrier film and further layers primarily of plastic for lamination onto a substrate and foil strips, primarily of plastics not for packaging purposes; ] semi-finished goods of plastics or primarily of plastics and/or polymers, namely, films, plastic laminates, [ laminating foils ] * except adhesives in form of separated foils or separated films * [, stamping foils; semi-finished goods, namely, injection-moulded parts primarily of plastic materials and polymers for manufacturing semiconductor, electrical, electronic and optical components, namely, for manufacturing electrical, electronic and optical switches, sensors, integrated circuits, capacitors, inductors, transistors, resistors, diodes, memory chips, data storage chips, transponder chips, electronic and optical data carriers, solar cells, printed circuit boards, integrated circuits, coated with completely or partially transparent or translucent functional layers, particularly with completely or partially transparent or translucent electrodes or conductive tracings, particularly manufactured by means of foil decoration methods during the injection-moulding process; semi-finished goods, namely, injection-moulded parts for integration into electronic products primarily of plastic materials and polymers for receiving electronic circuits and electronic components, containing non-conductive and semi-conductive and conductive functional layers, particularly manufactured by means of foil decoration methods during the injection-moulding process ];Color is not claimed as a feature of the mark.;[ Allocation of licences regarding intellectual property rights and copyrights regarding know-how in the field of electricity and electronics, including polymer electronics; * all aforementioned services not in relation with optical measuring and lighting systems, laser systems for measuring purposes, conductive adhesives * ];Research, development and technical consultancy in the field of electronics [, consultancy concerning and comprising technical analysis for franchising concepts in the field of electronics, including polymer electronics ] ; technical consultancy regarding possibilities for the use of electrical functional layers, particularly of transparent or translucent functional layers in the field of electronics and of electronic circuits and/or electronic components; research, development and design of electrical functional layers, particularly of transparent or translucent functional layers in the field of electronics and of electronic circuits and/or electronic components; * all aforementioned services not in relation with optical measuring and lighting systems, laser systems for measuring purposes, conductive adhesives *; |
| POLYTC | PolyIC GmbH & Co. KG | Tucherstrasse 2 90763 Fürth Germany | Semiconductor, electrical, electronic and optical components, namely, electrical, electronic [ and optical ] switches, sensors, integrated circuits, capacitors, inductors, resistors, [ diodes, memory chips, data storage chips, transponder chips, electronic and optical data carriers, solar cells; ] electronic circuits, active or passive electronic components, namely, transistors, diodes, resistors, capacitors, inductors, resistors, and integrated circuits, electrodes, electric and electronic conductive paths, * except adhesives serving as electrodes or conductive paths, * conductive pads, [ antennas, ] electrical and electronic operator control elements, namely, touchpads, touch sensors and touchscreens, for integration in electronic apparatus and devices of all kinds for electronic hand-held apparatus, for portable and mobile communication devices, for portable audio and/or video players, for computers, for control devices, for electronic apparatus and machines [, ] * ; * [ visual display elements, namely, electronic and/or optical displays of all kinds as components for electronic devices and apparatus, light-emitting or laser diodes as components, displays, namely, LCD displays, OLED displays, electrophoretic displays; ] electrical circuits, namely, electronic and optical and optoelectronic circuits and components therefor; * except for optical measuring and lighting apparatus as well as laser systems for measuring purposes; * electronic components, namely, electrical, electronic and optical switches, sensors, integrated circuits, capacitors, inductors, resistors, diodes,[ memory chips; data storage chips, transponder chips, electronic and optical data carriers, solar cells, transistors; ] electrical and/or electronic functional layers, namely, completely or partially transparent or translucent electrodes or conductive paths, namely, conductive tracings on printed circuit boards and conductive tracings as part of electronic circuits [ ; ] *, * * except adhesives serving as electrodes or conductive paths; * Electric conductors and electronic conductors, electric circuits and electronic circuits [ and electric sockets and electronic sockets ] consisting of completely or partially transparent or translucent materials like polymers or completely or partially transparent or translucent metal layers or patterned metal films or patterned metal layers applied on or integrated in flexible carrier materials, * except conductive adhesives *; * [ *; all the aforementioned goods also being encodable as well as with optically active interference, polarization and/or liquid crystal layers and/or optically active spatial structures; ] all goods as foil sheets, foil sheetings [ and foil tapes, particularly roll goods, stickers ], tags, [ tapes, filaments, discs, ] cards [ boards or integrated into packaging ] ; all the aforementioned goods for general industrial use as well as for use in the field of electronics and polymer electronics and also for electronic appliances, displays, touchscreen displays, capacitive switches, keys and/or sensors [ and also for solar cells ];Line 13, except adhesives serving as electrodes or conductive paths, should be inserted after electronic conductive paths in class 9. Page 2, line 13, except such goods coated with conductive adhesives and except conductive adhesives should be inserted after tags in class 17. The following all the aforementioned services not in connection with optical measuring and lighting apparatus, laser systems for measuring purposes, conductive adhesives should be inserted at the end of class 42. the aforementioned services not in connection with optical measuring and lighting apparatus, laser systems for measuring purposes, conductive adhesives should be inserted at the end of class 45.;Plastic materials and polymer materials, namely, [ bands, tapes, ribbons, ] sheets, films, foils, laminates, for manufacturing purposes namely, for manufacturing stickers and tags, * except such goods coated with conductive adhesives and except conductive adhesives, * circuit boards, electronic circuits, electronic and semi-conductor components, [ displays, photovoltaic cells, ] sensors, touch sensors, [ optical security elements; plastic tapes, not for medical purposes and not for household purposes, of plastic materials or mainly of plastic materials and/or polymers, plastic filaments, not for textile purposes, for manufacturing electric components and electronic components, electric circuits and electronic circuits, circuit boards, semi-conductor components, displays, photovoltaic cells, sensors, touch sensors and optical security elements; ] goods of plastic or mainly of plastic and/or polymer materials, namely, [ discs, ] cards, sheets for manufacturing purposes; completely or partially transparent or translucent foils of plastics and/or of polymers, except for packaging, for use as electric or electronic functional layers, electric or electronic circuits or electrodes or conductors, namely, plastic foil sheets, plastic foil sheetings * ; * [ and plastic foil tapes; ] completely or partially transparent or translucent plastics and/or polymer materials, semi-finished goods, except for packaging, for use in manufacturing electric or electronic functional layers, electric or electronic circuits or electrodes or conductors; completely or partially transparent or translucent plastic or polymer materials, semi-finished goods, also comprising metal and/or conductive polymers, applied on flexible carrier substrates, for use as electric or electronic circuits or electrodes or conductors; [ stamping foils, namely, hot-stamping foils and cold-stamping foils, other than for packaging; transfer foils and laminating foils and foil strips, primarily of plastics, except for packaging purposes; stamping and transfer foils, other than for packaging, namely, foils consisting of a carrier sheet material made primarily of plastics and at least one transfer layer which is removable from said carrier sheet material and transferable to a substrate; laminating foils, namely, plastic laminating foils consisting of a carrier sheet material made primarily of plastics and further layers primarily made of plastics for lamination onto a substrate; ] semi-finished goods of plastic or polymer materials, namely, [ self-adhesive foils, ] plastic laminates, [ laminating foils, stamping foils ] for use in manufacturing, particularly for manufacturing electric or electronic functional layers, electric or electronic circuits or electrodes or conductors, displays, [ photovoltaic cells, ] sensors, touch sensors [, ] * ; * [ optical security elements; injection-moulded plastic materials and injection-moulded polymer materials and injection-moulded plastic/polymer composite materials, ] semi-finished goods, particularly coated with completely or partially transparent or translucent functional layers, particularly completely or partially transparent or translucent electrodes or conductive paths, by means of film decoration methods during the injection-moulding process for use as electric or electronic functional layers, electric or electronic circuits or electrodes or conductors; all the aforementioned goods for general industrial and manufacturing use as well as for use in the field of electronics and polymer electronics and also for use in electronic appliances, displays, touchscreen displays, capacitive switches, keys as well as sensors [ and also for solar cells ];POLY TC;[ Licensing of intellectual property rights and copyrights in the field of electronics, particularly of polymer electronics; * the aforementioned services not in connection with optical measuring and lighting apparatus, laser systems for measuring purposes, conductive adhesives * ];Research, development and technical consultancy in the field of polymer electronics, technical consultancy in the form of providing technical advice in the field of electronics, and polymer electronics; technical consultancy in the field of electronics concerning the possibilities of use of electrical functional layers, particularly of transparent or translucent functional layers; research, development and design of electrical functional layers, particularly of transparent or translucent functional layers in the field of electronics; * all the aforementioned services not in connection with optical measuring and lighting apparatus, laser systems for measuring purposes, conductive adhesives *; |
| PUREVU | MARVELL ASIA PTE, LTD. | Tai Seng Centre, 3 Irving Road, #10-01 Singapore 369522 Singapore | Semiconductor; video processors; application specific integrated circuits (ASIC); application specific standard products (ASSP), namely, encoders, television decoders, optical filters; software for video processing, namely, editing, manipulation, graphics rendering; video processing modules, namely, video, moving pictures experts group (MPEG) video, networking processors for use as component parts of video processing subsystems, video processing systems, video conferencing systems, broadcast cameras, sporting even video systems, video distribution systems;PURE VU; PURE VIEW; |
| QP SEMI | e2v aerospace and defense, inc. | 2945 Oakmead Village Court Santa Clara CA 95051 | SEMICONDUCTOR;Integrated circuit design and testing; |
| SIERRA SEMICONDUCTOR | PMC-SIERRA, INC. | 3975 Freedom Circle, Suite 100 Santa Clara CA 95054 | SEMICONDUCTOR;INTEGRATED CIRCUIT DESIGN SERVICES, AND FOR CUSTOM DESIGN AND CONSULTING IN THE FIELD OF INTEGRATED CIRCUITS AND DESIGN; |
| SIERRA SEMICONDUCTOR | DELAWARE PMC-SIERRA, INC. | 3975 FREEDOM CIRCLE SANTA CLARA CA 95054 | SEMICONDUCTOR;INTEGRATED CIRCUIT DESIGN SERVICES, AND FOR CUSTOM DESIGN AND CONSULTING IN THE FIELD OF INTEGRATED CIRCUITS AND DESIGN; |
| SILICONQOS | LSI CORPORATION | 1320 Ridder Park Drive San Jose CA 95131 | Semiconductor;SILICON QOS;SILICON; |
| UNICROSS | Crosslayer Networks, Inc | 42840 Christy Street #205 Fremont CA 94538 | semiconductor;UNIFIED CROSS; |
| WAVEBLASTER | CommASIC, Inc. | Suite 301 16644 West Bernardo Drive San Diego DE 92127 | Semiconductor;WAVE BLASTER; |
| WBSP (WIRELESS BROADBAND SIGNAL PROCESSOR) | CommASIC, Inc. | Suite 301 16644 West Bernardo Drive San Diego DE 92127 | Semiconductor;WIRELESS BROADBAND SIGNAL PROCESSOR; |
Where the owner name is not linked, that owner no longer owns the brand |
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